Technology News
IBM with new SOI boost
IBM has successfully developed a and up to four times as dense as any
prototype of the semiconductor comparable 32nm embedded SRAM in
industry’s smallest, densest and fastest the industry. Higher memory density
on-chip dynamic memory device in can lead to chips that are smaller, more
next-generation, 32-nanometer, silicon- efficient and can process more data,
on-insulator (SOI) technology. improving system performance.
IBM’s SOI technology can provide The IBM eDRAM in 32nm SOI
up to a 30 percent chip performance technology is the fastest embedded
improvement and 40 percent power memory announced to date, achieving
reduction, compared to standard bulk latency and cycle times of less than 2 “We are making this 32nm offering
silicon technology. SOI protects the nanoseconds. available to clients who are ready to
transistors on the chip with a “blanket” In addition, the IBM eDRAM uses benefit from the significant
of insulation that reduces electrical up to four times less standby power performance and power advantages of
Issue VII 2009
leakage, saving power and allowing (power used by the chip as it sits idle) this seventh generation of IBM SOI
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current to flow through the circuit more and has up to a thousand times lower technology,” said Gary Patton, vice
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efficiently, improving performance. soft-error rate (errors caused by president for IBM’s Semiconductor
IBM has fabricated a test chip with electrical charges), offering better Research and Development Center.
an embedded dynamic random access power savings and reliability compared IBM was the first company to begin
memory (eDRAM) technology that to a similar SRAM. commercially shipping SOI technology,
features the industry’s smallest memory IBM intends to bring the benefits of which has been used in applications
cell, and offers density, speed and its 32-nanometer SOI technology to a from game consoles to servers. The
capacity better than conventional on- wide range of application-specific 32nm SOI technology offering
oasiasemiconductor
chip static random access memory integrated circuit (ASIC) and foundry represents IBM’s continued
.eur
(SRAM) announced in 32nm and 22nm clients and will use the technology in commitment and expertise in research,
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technology, and comparable to what chips for its servers. development and manufacturing for
would be expected of an SRAM IBM already is engaged with early next-generation technology.
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produced in 15-nanometer technology - access foundry clients in 32nm IBM is a member of the SOI
three technology generations ahead of technology and ARM is developing Industry Consortium, an international
chips in volume production today. design libraries for the technology. An group aimed at accelerating broad
IBM’s eDRAM cell is twice as dense initial 32nm ARM library is available adoption of SOI technology across
as any announced 22nm embedded now and IBM has extended this semiconductor markets, and is working
SRAM cell - including the world’s collaboration to include 22nm SOI through the Consortium on enabling a
smallest 22-nanometer memory cell technology, enabling ARM to gain early robust intellectual property portfolio for
announced by IBM in August 2008 - access to this technology. a wide range of applications.
Re writing polymer memory
POLYIC AND THIN FILM ELECTRONICS Rolf Åberg, CEO of Thinfilm, and by using our process and
have announced that they have jointly stated: “We are very pleased by the production technology, we have been
manufactured fully functional re-writable results of the collaboration with PolyIC, able to successfully manufacture stand-
polymer memory products in a high- and with their ability to produce alone Thinfilm memory products that
volume roll-to-roll printing process. The Thinfilm polymer memory in a high satisfy our current customer
printing process gives production volume, cost effective printing process. requirements. We look forward to
performance, and the resulting memory PolyIC, which is owned by Siemens and developing products combining
product meets low voltage Leonhard Kurz, is a stable, long-term Thinfilm’s and our technology”,
requirements for consumer products, production partner for Thinfilm, as we commented Wolfgang Mildner,
such as in the toys and games industry. start providing our customers with Managing Director at PolyIC.
The Thin film re-writable memory memory products in large volumes.” The joint development and the
together with a reader/writer provides a “PolyIC has developed and built up results are built on Thinfilm’s IP for
platform for Toy and Game designers to a roll-to-roll production process for soluble memory materials, architecture
create the next generation of printed electronics, and has successfully and processes, as well as PolyIC’s’
interactive and evolvable toys and demonstrated its first printed RFID tags. intellectual property and know-how for
games where the memory could be Thinfilm’s memory technology is technology, processes and
linked to the online world. complementary to our own technology, manufacturing techniques.
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