IC Industry Awards Winners
Award Fab Management
Company MASER Engineering
Fast board level
interconnect test service
MASER Engineering has extended its test and
diagnostic services with a tool for board level
interconnect tests.
Modern Chip Scale and Ball Grid array
packages are the most common package style
for Integrated Circuits in consumer handheld
equipment. The introduction of lead-free solder
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interconnects have resulted in a change in the
contact reliability. The long history of leaded
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interconnects had to be replaced by new models
.eur of the failure mechanism and test data.
oasiasemiconductor
The first test results were also used to adjust
the metallurgical properties and the assembly
process. To have fast feedback, new test
methods have been developed too. In addition
to the conventional stress test, based on slow
and fast temperature cycling tests, new
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techniques and systems were introduced for of systems for mechanical stress test of solder
even faster accelerated stress tests. interconnects. The core of the system is a
A major player in hand held applications precision sine movement of a two point bending
square4
Issue VII 2009
defined a bouncing drop test with a new tool. The daisy-chain devices are mounted on a
designed drop test system. This test method mobile phone simulating PCB and connected to
uses continuously monitored daisy-chain devices a resistor scanner system. The test board is
and glitch detection during the 1500g shock supported at the two edges and pushed down
impact. The drop test system has a specific at two points with a defined distance. The
construction to allow multiple drop endurance bending amplitude results a lateral mechanical
testing in a reasonable time. force on the metal interconnections. The system
MASER Engineering has made this test is able to maintain precision bending at 5 Hz for
capability available to customers in order to large amount of bending movements. The
evaluate the robustness of the SMD solder system can be programmed to bend until a
interconnect system of the chosen package. Also specific failure mode in one or all devices on the
demonstrated, further impact on contact PCB. Detailed failure analysis and SEM/EDX
reliability due to the introduction of low-K oxides inspection will show the defect properties in the
in sub 100nm technology devices. With the fast intermetallic layer that has cracked. The
accelerated test method, this effect could be mechanical drop test, bending systems and the
examined before the market introduction, thus F/A tools are available to component suppliers
saving big field return costs. This tool for fast and OEM companies that require detailed
board level bending tests is added to the range reliability data on their connection technology.
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