IC Industry Awards Winners
Award Metrology / Test / Yield
System Explorer Inspection Cluster
Company Rudolph Technologies, Inc
Explorer Inspection Cluster
Issue VII 2009
The Explorer Inspection Cluster claims fast,
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accurate and reliable macro inspection with
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flexible configuration of multi-surface inspection
capabilities. The Explorer Architecture allows
individual systems to be configured with any
combination of wafer front, back, and edge
module allowing the user to mix and match
throughput and inspection type to best fit
specific requirements and reduce cost-of-
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ownership.
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The Explorer Architecture is a modular
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approach to wafer inspection consisting of one
or more inspection modules with brightfield and
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darkfield illumination, a substrate handler, and
software that coordinates the activities.
The Explorer Inspection Cluster is an edge
and backside inspection system claiming low
cost-of-ownership to the IC industry, while the
NSX is used for high-volume inspection and
metrology of next-generation production
processes.
The Explorer’s edge and backside modules
both use image-based inspection for a more in-
depth data set than light scattering
techniques.Controlling edge and backside
defectivity has become one of the critical factors
for enabling 45nm and 32nm processes, and the
Explorer offers a combination of sensitivity and
cost of ownership to address these issues.
In addition, Discover data analysis software,
offered as an option, further enhances efficiency
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