IC Industry Awards Winners
Award Wafer Processing - BEOL
System VOTAN G Semi
Company Jenoptik Automatisierungstechnik GmbH
VOTAN G Semi
Issue VII 2009
square4
.com
VOTAN G Semi, is a wafer
dicing system that utilises
Thermal Laser Separation
(TLS). The system was
developed as an
alternative to established
oasiasemiconductor
mechanical dicing saws
.eur
and other laser dicing
www
technologies to deliver a
highly precise cutting
33
edge. It is especially well
suited for applications
with special demands on
edge quality – like optical
devices or power devices
with vertical current flow.
TLS-Wafer-Dicing by
JENOPTIK
Automatisierungstechnik
GmbH is a full separation
technology for semiconductor materials.
The Thermal Laser Separation (TLS) process
thermally induces mechanical stress in the Future options:
material using a laser to perform the dicing ring6 water free gas cooling
process. ring6 SECS/GEM interface
ring6 Advantages
The Equipment
The JENOPTIK-VOTAN Semi 300 is a complete Higher yield as a result of the zero kerf in
dicing equipment for back-end class 6 clean combination with the increased bending
rooms. The JENOPTIK-VOTAN Semi 300 strength of the diced dies (no chipping or micro
processes film frame mounted wafers cracks occur).
(150 mm - 300 mm; 6“ - 12“) fully automatic. Higher throughput by the unrivalled dicing
The optional handling operates one/two speed (up to 300 mm/s) for thin wafers (50 ...
magazines. The JENOPTIK-VOTAN Semi 300 – 250 µm). Reduced cost of ownership because of
including the laser – is a low maintenance the ablation free process – neither protection or
equipment. The tool comes with our patent cleaning steps nor consumables are required.
pending edge protection stretch technology and The excellent edge quality in combination
a couple of control and measurement tools with other advances can be used for new and
(alignment camera, kerf-check microscope, code improved products like power devices, MEMS,
scanner). optical devices or RFID.
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