New Products
thermal performance of the T-flex™ line print passes and results showed absolutely shortening the learning curve for first-time
by increasing the thermal conductivity no damage to any of the devices. www. users of CFdesign and adding industrial-
to 5.0 W/mK. The soft material is
ovation-products.com strength problem solving capabilities to the
highly compliant, allowing for thinner engineering desktop.
interfaces and overall improved thermal
Jtag/Boundary scan platform
www.cfdesign.com
performance as measured by total thermal
scanFleX® incorporates new PXI
resistance. High compliancy accommodates
controllers for critical applications
mouser electronics now stocking
applications where the tolerance stack-up
Goepel electronic introduced a new
triQuint-WJ’s new WJa family
is high and the maximum mechanical
series of PXI-bus-based controllers for
Mouser Electronics, Inc., is now stocking
stress on the components must be low. The
its boundary scan hardware platform
WJ Communication’s WJA1001 and
T-flex™ 700 is naturally adhesive for ease of
SCANFLEX®.
WJA1021—the latest additions to their +5V
handling and assembly.
The new SFX/PXI1149/C4-FXT
Active Bias General Purpose Gain Block
www.lairdtech.com
controllers incorporate the normally
amplifier series. WJ Communications,
external SCANFLEX® TAP transceivers
Inc, recently acquired by TriQuint
into the 1 slot/3U unit, whereas the TAP
Semiconductor, supplies radio frequency
interface cards (TIC) are linked externally.
(RF) products and solutions for the
The TICs are active so the complete signal
wireless infrastructure and radio frequency
conditioning is performed directly within
identification (RFID) reader markets. www.
the test fixture or environmental test
mouser.com
chamber for HASS/HALT applications.
Four different auto-identified TIC types
microchip technology introduces
are available to accommodate various
low-power, auto-zero operational
applications. The differential signal amplifiers (op amps)
interface ensures a secure transmission of Microchip Technology Inc.’s
the TAP signals, even through multiple MCP6V01/2/3 (MCP6V0X) auto-zero, low
suss microtec unveils 300mm
interconnections and with over 4 meters of power, operational amplifiers (op amps)
mask aligner for 3D packaging
cable length, a TCK clock frequency of up feature a unique self-correcting architecture
The second generation of SUSS MicroTec’s
to 80 MHz can be maintained. that enables ultra high precision, with an
MA300 production mask aligner features
www.goepel.com input offset voltage of just 2 µV maximum.
a dedicated alignment kit for creating 3D
They also feature high common-mode
interconnects for applications like chip
gore introduces online builder
rejection, rail-to-rail input/output and low
stacking and 3D image sensor packaging.
for specifying ultra high density
quiescent current, making them ideal for
The new 3D-Alignment platform enables
interconnects
portable, battery-powered instrumentation
bottom side and infrared alignment for
W. L. Gore & Associates (Gore) introduced
devices, such as those used in the industrial
300 mm-based three-dimensional (3D)
an online builder for configuring GORE™
and medical markets.
www.microchip.com
packaging lithography applications, thereby
ultra high density (UHD) interconnects to
agilent introduces low-cost Dc
enabling cost effective mask aligner systems
use in bench-top test systems, instrument
to meet the most aggressive technology
probe cable, parallel data link, production
roadmaps for thick resist applications
floor equipment, and automated test
and keep costs low relative to 1X Stepper
equipment. The new Ultra High Density
lithography solutions.
www.suss.com
Interconnect Builder is available at
www.gore.com/uhdbuilder
Fraunhofer report affirms superior
performance of ovation’s hD grid-
power supplies with features typical
lok™ board support technology
of costly models
The results of a study conducted by the
Agilent Technologies Inc. introduced
well-respected Fraunhofer Institute and
the U8000 series single-output, non-
commissioned by German electronics
programmable DC power supplies, a low-
distributor Ben Technologies have
cost expansion of the best-selling Agilent
confirmed that Ovation Products’ HD Grid-
E3600 series. Beyond cost savings, these
Lok reconfigurable tooling technology is an
DC power supplies offer excellent value
extremely robust and cost-effective support
with features that are typical only in costly
solution for modern electronics production.
programmable models. With power ranging
Scientists at Fraunhofer used a 240 x
from 90 W to 150 W, they are suitable
135 x 1.6 mm PCB mounted with a variety
for a variety of electronics-manufacturing
of fine-pitch SMT components including
Blue ridge numerics announces
applications and provide reliable, affordable
0805, 0402 and 0201 passive devices,
power for educational uses.
www.agilent.com
cFdesign v10 upfront cFD software
QFPs, flip chips and BGAs. The goal was
Blue Ridge Numerics has announced
to determine the maximum occurring print
spheretek process guarantees
the availability of version 10 of CFdesign
loads on the device surfaces located on the
upfront CFD software, the company’s
solder sphere tolerances down
underside of the PCB. Pressure sensors were
flagship application dedicated to
to ±2.5 µ
used to monitor components on the bottom
empowering engineers with CAD-driven
SphereTek LLC introduced a unique
side of the board, with measurements taken
tools that optimise fluid flow and thermal
process that guarantees solder sphere
at eight different points to examine pressure
performance during the digital design
tolerances down to ±2.5 µ, delivering
load on the devices in the Z direction.
phase.
guaranteed uniformity and sphericity.
Squeegee pressure was systematically
In this major software release, Blue
SphereTek offers standard sizes from 50µ
increased from 40 N to 160 N over several
Ridge Numerics has focused on further
to 1250µ diameters and can work with
54 – Global SMT & Packaging – September 2008
www.globalsmt.net
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