Decent start in 2008—what about the next 18 months?
Cookson Electronics: Starch and Chemical. Executive Team to a 140,000 SF Norcross, GA, facility.
• transferred its chemical and flux pro- will include: Michael Todd (product Mirtec opened a new AOI manufacturing
duction to the Netherlands. development), Andreas Mader (semicon- facility in Ahnsung, Kyungki-do, Korea.
• will move its Ashford, UK, manufactur- ductor), Joe DeBiase (PCB fab & mate-
Mitsui Mining & Smelting:
ing site in early 2010. rials), Doug Dixon (global marketing),
• opened a resin coated copper plant with
• moved its solder paste manufacturing Michael Reilly (operations), Zhiwei Cai
a capacity of 500,000 m
2
/month.
to a new facility in Dunaharaszti (near (business development), Luc Godefroid
• expanded its capacity of ultra thin
Budapest). (project management) and Hilary Norris
electrolytic copper foil with carrier to
• launched its zero halogen initiative for (finance).
450,000 m
2
/month in Saitama, Japan.
Alpha products. Heraeus released a conductive adhesive line
• developing new resin material with
DEK appointed Michael Brianda president. designed specifically for flexible circuits. semiconductor performance for resin
Dover sold its subsidiary Triton Systems of Hexion Specialty Chemicals/Huntsman coated copper.
Delaware to Nautilus Hyosung. merger agreement was terminated. Molex developed new SMT attach method
Dow Chemical will acquire Rohm & Haas HDL Works released IO Checker, a FPGA that features excellent fatigue strength and
for $18.8 billion. and PCB IO verification tool. low applied costs.
ESI: Hitachi Chemical: Nichiyu entered the PCB materials business
• introduced its picosecond laser-based • developed new film type optical wave through new product development with
solution for wafer singulation. guides for PCBs with core sizes of Oki Printed Circuits.
• partnered with STMicroelectronics to 30
~
100 micron. Nikko Metal commercialized 8 and 9
develop an advanced laser singulation • investing 520 million yen for a PWB micron thick RA copper foil for hinge flex
solution. R&D center in China for dry film circuits in cell phones.
Essemtec opened a new 1,220 sq.m. build- resists. Oki Cable developed industry’s first 3D
ing including production space, office space Hitachi Plant Technology commercialized wiring system with double-sided flexible
and a new canteen. its MEISTER MS-510 screen printer for circuits.
Fine Line Stencil received the ‘2008 Ad- small and middle size circuit boards. Ormecon’s organic metal nanofinish
vanced Packaging’ award for its Slic-Blade IPTE acquired Estonian automation com- created the least environmental pollution
squeegee blades. pany, TAF3. according to tests by Federal Environment
Francisco Partners sold its subsidiary Met- Kester appointed Cluff & Associates as rep- Agency.
rologic Instruments to Honeywell. resentatives for Colorado, Montana, Utah, Optomec and Applied Nanotech Holdings
Fulltech is building the world‘s largest fiber- Wyoming and southern Idaho. are cooperating on copper inks for aerosol
glass yarn plant in Huwei, Taiwan, with an Lincoln International hired Tetsuya Fujii to jet printing of electronics.
annual production capacity of 45,000 tons/yr. run its new Tokyo Office. Orbotech introduced the first automated
Furukawa Electric acquired Furukawa Machine Vision Products named Paul optical repair system for bare PCBs.
Circuit Foil. Groome sales and marketing manager for ORC introduced its DXP-3502 LDI ma-
GSI Group acquired Excel Technology for Western N American and corporate ac- chine for etching resist and solder mask.
$360 million. counts. Palomar Technologies management bought
Henkel: Mania Technologie Belgium NV appointed out its original investor group.
• launched research and failure analysis LMCIS LLC its representative for North PartMiner unveiled MarketPuls, a new pro-
center with Shanghai University. America. curement tool for electronic components.
• relocated its N American corporate Manncorp introduced its Hi Output turn-
Phoenix Precision Technology developed a
headquarters from Gulph Mills, PA, to key assembly line for mid to high-volume
metal electroplating process.
Rocky Hill, CT. flexible SMTs.
Photo Stencil promoted Skye McDaniel
• named Alan Syzdek director of its Matsushita developed low-cost recycling
to sales manager and Bill Vaughn to CAD
Adhesives and Electronics Materials system for low-concentration solvents.
manager.
businesses acquired from National
Micromeritics moved its U.S. headquarters
PROMATION:
20080802
20080808
Large EMS Providers
Electronic Equipment Production Growth
Composite of 11 Public Companies
Current $ Growth Rates Converted @ Constant Exchange Rates
Revenue, Net Income & Inventory
US$ Billions @ fluctuating exchange
40.0
2006 2007 2008 2009 2010
Preliminary 2Q'08 results based upon a
+8%
World 9.6 9.1 6.4 6.1 8.4
combination of actual & estimated financials
30.0
USA 6.3 1.6 1.9 2.8 5.2
20.0
W Europe 1.1 5.9 6.2 1.8 4.4
10.0
Japan 3.6 -1.5 -2.7 1.2 3.5
0.0
Four Tigers 8.2 9.0 4.8 4.3 6.0
-10.0
1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2
00 01 02 03 04 05 06 07 08
Revenue 12.7 15.4 18.1 21.5 19.0 16.6 15.3 15.5 14.6 15.5 16.0 17.2 15.5 15.4 17.3 19.4 18.1 19.2 20.4 21.8 20.3 21.3 21.7 24.6 21.6 23.6 26.5 30.0 25.0 27.0 29.5 33.0 27.6 29.1 China 22.3 21.3 13.8 13.2 14.5
Income 0.3 -0.0 0.4 0.5 0.2 0.0 -0.4 0.0 -0.0 -0.1 -2.5 -0.3 0.1 -3.3 -0.2 0.1 0.3 0.4 0.4 -0.2 -0.7 0.4 0.6 0.7 0.4 0.7 0.7 0.9 0.6 0.6 -0.2 0.1 0.5 0.8
Inventory 7.1 8.9 11.6 12.8 13.3 11.6 10.2 8.7 7.9 7.4 7.0 6.6 6.6 6.6 6.9 7.4 8.0 8.1 8.2 8.2 8.1 8.3 8.9 9.1 9.8 11.7 12.9 12.4 12.5 12.2 13.3 12.3 12.0 12.5
Benchmark+Pemstar, Celestica, Elcoteq, Flextronics+Solectron, Foxconn, Jabil, Plexus, Sanmina-SCI, Sypris, Henderson Ventures 8/2008
Universal Scientific, Venture Mfg
www.hendersonventures.com
Chart 7. Chart 8.
28 – Global SMT & Packaging – September 2008
www.globalsmt.net
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