New Products
New products
KIc introduces new profiler model jetting. In addition, Hysol FF6000 delivers module with 3D sensors is available
KIC introduced a new profiler model to broad application options that offer an immediately for Siemens’s Siplace X2 and
the successful KIC Explorer platform. The in-line, cost-effecitve alternative for such X3 placement solutions.
www.siplace.com
new model uses the modern KIC Explorer processes as ball attach, package on package
hardware and features a total of nine (POP) assembly, flip chip device and large
asymtek DispenseJet® DJ-9500
thermocouples using the standard type K format BGA and CSP assembly.
iup to 10 times faster than needle
TC connectors.
www.henkel.com/electronics
dispensers
As with all KIC profilers, the KIC
Asymtek introduced its new DispenseJet®
Explorer 9 channel features exceptionally
DJ-9500 fluid jetting valve for high-speed
easy to use software that measures a thermal
underfill applications and jetting silicone
profile quickly and accurately. The optional
for LEDs. The DJ-9500’s flexible pneumatic
Auto-Focus process optimization software
design can jet a wide variety of fluids up
automatically selects the best oven setup
to 10 times faster than existing needle type
for each application within seconds. www.
dispensers, even with abrasive fluids. The
kicthermal.com
new design enables compatibility with a
wider range of fluid types, and opens the
process window to allow a robust jetting
solution. DJ-9500 users will benefit from
improved fluid control, better repeatability,
increased flexibility, and a lower cost of
now available: Quad thinPro
ownership.
www.asymtek.com
electronic tape feeder
Introducing Tyco Electronics’ latest 8mm
thin profile feeder, which provides greater
accuracy and performance for all your
0201/0402 component requirements. The
Fct solder introduces Ws170 non-
ThinPRO feeder is designed to provide
hygroscopic water-soluble solder
optimum pick efficiency, maximizing
paste
placement yields for tape fed components
FCT Solder, a division of FCT Assembly
smaller than .040 (1 mm). The feeder is
and an authorized licensee of Nihon
totally interchangeable with previous QUAD
Superior Co. Ltd.’s SN100C product
assembly equipment platforms. The narrow
line, premiers WS170 water soluble
profile of .600” (15.24 mm) when coupled
solder paste, a second-generation water
with the new ThinPRO Feeder base will
soluble solder paste chemistry currently
increase your feeder capacity up to 30%.
intended for Sn62/Sn63 applications. It
www.goppm.com
is developed specifically to sustain optimal
performance throughout a wide spectrum of
environmental conditions.
WS170 produces fully wetted, bright
shiny solder joints, and has the activity
BPm microsystems improves
necessary to solder to common hard-to-wet
Flashstream technology
alloys such as gold, platinum, palladium,
BPM Microsystems’ Flashstream technology,
silver, alloy-42 and bare copper.
which was first introduced in August 2007,
www.fctassembly.com
has undergone many improvements since
its original release. Flashstream will support
Breakthrough epoxy flux offers flux
memories up to 32 gigabit by the end of
functionality & underfill protection
new siplace coplanarity module
2008 and will be hardware upgradeable as
in one
now with fast 3D sensors
future device densities become reality in the
Henkel’s breakthrough epoxy flux
Components with inferior quality can
marketplace. The Flashstream technology
material, Hysol® FF6000, combines flux
severly hinder the productivity of a
has also incorporated utilization of cache-
functionality and underfill protection into
placement machine. The new Siplace
programming modes in select devices,
a single material. A reflow-curable material,
3D Coplanarity Module from Siemens
pushing the top speed of the Flashstream
Hysol FF6000 has been formulated to
Electronics Assembly Systems (EA) makes
on NAND memory to an amazing 8.23
provide fluxing action for lead-free solder
such limitations a thing of the past. The
megabytes per second data transfer during
joint formation and, when cured, delivers
new module is particularly attractive for
programming.
underfill-like protection against mechanical
electronics manufacturers who produce
Flashstream now supports MLC (multi-
stress. The versatility of the material allows
for customers with the highest quality
level cell) flash memory and managed
for various deposition methods including
requirements, like those in the automotive,
NAND architecture like eSD/eMMC, such
screen printing, dispensing, dipping and
aerospace and medical industries.
as Samsung MoviNAND, Micron e-MMC
The new generation of the coplanarity
and Sandisk iNAND.
www.bpmmicro.com
50 – Global SMT & Packaging – September 2008
www.globalsmt.net
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