New Products
automated inspection of solder and lead CASCON™.
www.goepel.com
defects, component presence and position,
correct part, polarity and through-hole
parts. Ideally suited for high-volume or
high mix manufacturing environments,
the F1 series helps to increase throughput,
improve quality and reduce costs. It is
equally effective for pre and post-reflow
applications.
www.yestechinc.com
DeK horizon 03i newly equipped
Long regarded as the premiere print
creative materials introduces
platform for maximum value and
exceptional manufacturing flexibility, DEK’s
118-06 series of die attach
Horizon 03i system is newly equipped with
adhesives and adhesive films
a redesigned gull wing cover to enable easy
Creative Materials’ new 118-06 series of
accessibility and operator convenience. In
unique single-component, electrically
addition, the Horizon 03i, run on DEK’s
conductive, B-stageable epoxy adhesives
award-winning Instinctiv™ V9 operating
is available for a variety of application
system, is now compatible with Productivity
techniques, such as screen-printing, pad-
printing, stencil application and B-staged
Virtual Industries introduces new
Tools that include the throughput
films. This series of products offers excellent
vacuum-tweezer tool
enhancing Cyclone understencil cleaning
thermal stability, outstanding high-
Virtual Industries’ TV-1000 vacuum-tweezer
technology, HawkEye™ high-speed print
temperature performance and an operating
tool allows parts from 2.54 mm (0.10”) to
verification tool and HD Grid-Lok®
temperature range of -55°C to 230°C.
several inches in diameter to be handled.
reconfigurable high-density tooling solution.
One application example is the assembly
The long-life diaphragm vacuum pump
www.dek.com
of electrical and electronic components
generates up to 10” of mercury with an
to flexible and rigid circuitry. In addition
open-air flow of 2.3 lpm. The ESD-safe unit
these products can be applied directly to
connects to a ground through a three-wire
the backside of wafers prior to the dicing
power cord. Accessories include small-parts
process.
www.creativematerials.com
tips to handle items as small as 100 µm and
pick-up heads with two or three pick-up
manncorP ‘hi output’ turnkey line
points to handle elongated or larger parts.
targets mid to high-volume flexible
Systems are available in 110 or 220 V
smt assembly
50/60 Hz. Prices start at US $198.50.
Manncorp’s ‘Hi Output’ automated
www.
vacuumtweezer.com
turnkey line features dual-gantry MC683
four-head pick and place with flying vision
and conveyor, with a mounting speed of
10,500 cph. Also included are the G300
fully automatic stencil printer, the CR8000
8-zone reflow oven and a pass-thru SMEMA-
compatible inline conveyor. The entire line
is Internet priced below $180,000. The
10,500 cph placement speed allows mid-
new boundary scan I/o modules
volume assemblers to step-up throughput
enable structural test of PcI
while benefitting from the increased savings
express slots
and service advantages of purchasing the
GOEPEL electronic introduced CION
entire line from a single-source provider.
Module™ /PCIe-x(1/4) as additional
www.manncorp.com
PromatIon develops Pass/FaIl
interface cards within the popular CION
sorting magazine system for Module product range. The new low-cost
Zestron’s Fast cleaning
batch aoI modules are plugged directly into a x1 or x4
technology
PROMATION announces that it has PCI Express slot and controlled by means
ZESTRON America is pleased to introduce
developed a dual magazine handling of a TAP (Test Access Port). Because of the
its newly developed FAST (Fast Acting
solution with slide shuttle that is excellent on-board IEEE 1149.1 and IEEE1149.6 test
Surfactant Technology) Technology.
for sorting suspect PCBs after AOI. This channels all high speed signal pins, low
FAST Technology-based cleaning agents
solution provides for PASS/FAIL sorting speed signal pins and voltage supply pin
are a proprietary mix of newly developed
when AOI is utilized in a batch or end-of- of PCI Express compliant connectors are
surfactants, which allows for a quicker
line process. structurally testable.
removal of a wide variety of the latest
The SCUD-66PF accepts PASS/ The new hardware module is completely
lead-free and eutectic flux residues. When
FAIL signals through a modified SMEMA supported by all JTAG/boundary scan
compared to traditional surfactant-based
interface and places the PCB into the controllers of the ScanBooster™ and
cleaning agents, this new technology
proper magazine location (good or suspect) SCANFLEX® families as well the integrated
removes flux residues under 1 MIL standoff
after inspection.
www.Pro-mation-Inc.com boundary scan software platform SYSTEM
components at a 1.7ft/min. belt speed
52 – Global SMT & Packaging – September 2008
www.globalsmt.net
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