Contents
Volume 8, no. 9
september 2008
American edition
Global SMT & Packaging
is distributed by controlled
circulation to qualified
Contents
personnel. For all others, sub-
scriptions are available at
2 Is the “Faster, Smaller, Cheaper” model broken?
a cost of £165.00 for the
Trevor Galbraith
current volume (twelve issues).
12
Technology Focus
No part of this publication may
be reproduced, stored in a
12 Optimizing batch cleaning for removing lead-free flux
!
retrieval system, transmitted residues on PCAs
in any form or by any means Steve Stach, Austin American Corporation, and Mike Bixenman,
electronic, mechanical, DBA, Kyzen Corporation
photocopying, recording or
otherwise without prior writ-
20 Compatibility of polymers and fluxes:
20
ten consent of the publisher.
Getting to the heart of the matter
No responsibility is accepted for
Andy Mackie, Ph.D., and Christopher Nash, Indium Corporation
the accuracy of information
contained in the text,
32 A Breath of Fresh Air
illustrations or advertisements.
Claude W. “Bubba” Powers, Cooper Hand Tools
The opinions expressed in the
special FeaTures
articles are not necessarily those
of the editors or publisher.
30
30 Interview: Neil MacRaild—Ovation Products
ISSN No. 1474-0893
36 Show report: SMTAI survives Fay
© Trafalgar Publications Ltd
40 Show preview: IPC Midwest 2008
Designed and Published by
Trafalgar Publications Ltd,
Bournemouth,
United Kingdom
regular columns
Printed by Ovid Bell Press Inc.
Missouri, USA
4 Overlapped package structures—another
other regular Features
option for space savings
Joe Fjelstad
8 Industry News
6 PCB solderability changes with time—
50 New Products
what finish is best?
58 Association News
Bob Willis
60 International Diary
24 Decent start in 2008—what about the
next 18 months?
Walt Custer and Jon Custer-Topai
44 Forum on reliability for pb-free electronics
Werner Engelmaier
46 After-market services
Folkert Wierda and Ted Gardham
Front cover image design by
Vernicia Gallini.
www.globalsmt.net Global SMT & Packaging – September 2008 – 1
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