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ElectronicIndia IPC Midwest
2 - 5 September 23 - 25 September
Bangalore, India Shaumburg, Illinois, USA
Stand 534
Globaltronics
9 - 12 September 2008 Mexitronica
Singapore 21 - 23 October
Guadalajara, Jalisco,
ELCOMP India Mexico
10 - 12 September 2008
Pragati Maidan, New IMAPS 2008
Delhi, India 2 - 6 November
Providence, RI
Stand 115-17
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V
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For more information visit
EXHIBITION • TECHNICAL CONFERENCE • WORKSHOPS • NETWORKING •
8
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8
The Glloball Assemblly Journall ffor SMT and Vollume 8 Numberr 8 Augustt 2008
Advanced Packagiing Prroffessiionalls
ISSN 1474 - 0893 Summit
akellard@globalsmt.net
www.globalsmt.net Europe: +44 (0) 7765 277 677 | USA: +1 603 580 5549 | ASIA: +852 6339 6969
akellard@globalsmt.net ldandreti@globalsmt.net atan@globalsmt.net
22 – 24 October
Composite
Tallinn, Estonia
United States—Lino D’Andreti
One day of training workshops
Tel: +1 (603) 580-5549
followed by a two-day technical con-
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ference on all aspects of electronics
reliability and a tabletop exhibition.
Asia/Pacific—Amanda Tan
Organized in conjunction with
Tel: 852- 6339 6969
Don Naugler
Soldertec Global and sponsored by
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ADVANCES IN SOLDER BALL PLACEMENT NEW PRODUCTS
FOR SURFACE-MOUNTABLE PACKAGES
INDUSTRY NEWS
www.europeanelectronicsummit.com
Korea—S.I. Yun
UNDERSTANDING HIDDEN REACTIONS AND
August August THE IMPORTANCE OF PROFILE IN REFLOW
INTERNATIONAL DIARY
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20082008
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48 – Global SMT & Packaging – September 2008
www.globalsmt.net
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