New Products
and requires a reduced amount of active solutions. From Routers for tab routed
ingredients for the complete removal of panel singulation to saws for separating
contaminants from substrate surfaces. FAST panels with no tab or score-line, we will
Technology’s solid-free formula leaves no work with our customers to provide the
residues either on the substrates surface or most effective and economical solution for
within the equipment. their PCB depaneling needs.
www.zestron.com www.Fknsystek.com
lorD corporation develops non- laird technologies introduces t-
silicone thermal die lid attach Flex 700 series thermally conductive
LORD Corporation has developed a non-
gap filler
silicone thermal die lid attach (TDLA)
Laird Technologies’ T-flex™ 700 is the
adhesive in reponse to customers looking
next generation thermal pad in the
for a single material to replace having to use
T-flex™ gap filler line, improving the
two existing materials—such as a thermal
interface material (TIM) and a lid attach
adhesive. Key to success was formulation of
a material with excellent thermal properties
to replace typical TIMs, as well as excellent
adhesion to replace lid attach adhesives.
The performance of the new TDLA
has been validated using adhesion tests
as well as a variety of reliability tests. The
thermal adhesive shows little or no change
in thermal conductivity as measured by laser
flash methods and adhesion, as based on
shear testing, after 150 after being subjected
to standard reliability testing. www.lord.com
conductive adhesive line from
heraeus designed specifically for
flexible circuits
A line of fast-setting, one-component
conductive adhesives designed for the
connection of passive components and
bare dies on lead frames and printed circuit
board substrates has been introduced by
the Contact Materials Division (CMD)
of Heraeus. Ideal uses for the Heraeus
conductive adhesives include smart cards
and flexible circuits found in camera
phones and automotive or semiconductor
applications.
Unlike many conductive adhesives
on the market, the PC3200 series from
Heraeus is a one-part system that requires
no premixing. It does not have to be stored
below 40ºC nor shipped in dry ice, causing
it to be considered as a hazardous material
shipment. The adhesives can be shipped
with standard ice packs and stored in a
standard freezer. They are also solvent-free
and are formulated for stencil print, screen
printing or dispensing applications.
www.heraeus.com
economical manual circular blade
depanelizer
Available off the shelf from FKN Systek,
the K1000 manually operated circular
blade depanelizer is the safe and easy way
to separate pre-scored PCBs without dust or
scrap.
For higher volume production, the
K2000 motorized circular blade depaneler
can be used. FKN Systek supplies a full
range of made in the USA depaneling
www.globalsmt.net Global SMT & Packaging – September 2008 – 53
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