Show preview: IPC Midwest 2008
IPC Midwest Technical Conference—Wednesday, September 24, 2008
10:00 AM - 12:00 PM S01—Business Management
Moderator: Anthony Hilvers, IPC
Session covers the use of statistical data, finding free market research, taking advantage of the R&D Tax Credit and
avoiding risk and liabliities in the global marketplace.
10:00 AM - 12:00 PM S02—PCB I: Processing Boards in a Lead-Free World
Moderator: Dennis Fritz, MacDermid, Inc.
Materials and processes that once were fine for tin-lead processing may not do well in the higher temperature/
smaller process window of lead free. How will your boards hold up in this new world of lead free?
10:00 AM - 12:00 PM S03—Lead Free Alloy: A Pick of APEX 2008 Session
Moderator: Polina Snugovsky, Celestica International Inc., Canada
If you missed APEX 2008 but need to know the latest on lead free alloys to guide you in your technical choices then
join this first pick of APEX 2008 for the best and brightest papers on lead free alloy selection, testing and process-
ing.
1:30 PM - 3:00 PM S04—Cleaning
In a lead-free world cleaning is a new ball game. Presenters cover both process and testing in cleaning and failure
analysis.
1:30 PM - 3:00 PM S06—Assembly: The Pick of Apex:2008 Session
Moderator: Polina Snugovsky, Celestica International Inc., Canada
With assemblies continuing to grow in complexity for both surface mount and wave soldered designs the advent
of ROHS and its restrictions has caused complications beyond those due to simple increases in interconnection
density.
1:30 PM - 3:00 PM S07—PCB Fabrication
Moderator: David Lee, Johns Hopkins Applied Physics Laboratory
What are the new advances in PCB fabrication that will provide the industry with boards that meet toady’s design
and assembly challenges?
3:15 PM - 4:45 PM S08—PCB II: A Pick of APEX 2008 Session
As a follow up to PCB I we present a second session highlighting the Pick of APEX 2008 for PCB technology. Join
us for this special session showcasing the best of APEX 2008.
3:15 PM - 4:45 PM S10—Backward Compatibility
Moderator: Vern Solberg, Solberg Technical Consulting
Lead free is mandated for many products but not all. What’s an exempt manufacturer to do in this mixed up world
of lead and no-lead? This session addresses those issues for high reliability products.
IPC Midwest Technical Conference—Thursday, September 25, 2008
8:30 AM - 10:00 AM S1—REACH Compliance & the Global Supply Chain I
Moderator: Fern Abrams, IPC
This two part session provides an overview of how REACH will affect your business and what to do about it.
8:30 AM - 10:00 AM S12—PCB III: Pick of APEX 2008 Session
Moderator: David Lee, Johns Hopkins Applied Physics Laboratory
Our third session on PCBs brings you more up to date information to address your needs.
8:30 AM - 10:00 AM S13—Reliability I
Moderator: David Hillman, Rockwell Collins
What determines reliability? Can it be predicted? Are there obvious issues that can be identified or is all murky and
dark with lurking pitfalls to trap those unaware of the dangers? To help you gain in depth knowledge and under-
standing of issue sin reliability we present this first in a two part series
8:30 AM - 10:00 AM S14—Embedded Material & Design
Moderator: Vern Solberg, Solberg Technical Consulting
Embedded technology offers increases in density and performance for designers. How can you benefit from this
technology? Join our session on embedded and learn what in materials and design are available to benefit you!
10:15 AM - 11:45 AM S15—REACH Compliance and the Global Supply Chain II
Moderator: Fern Abrams, IPC
The second part of this two part session consists of additional supplier presentations on REACH compliance and
data sharing. A panel discussion with speakers from both sessions will discuss industry issues and needs and
answer your questions.
10:15 AM - 11:45 AM S16 —PCB IV
Moderator: Steve Gold, I-Connect 007
As a follow up to PCB III we present another session highlighting the Pick of APEX 2008 for PCB technology.
10:15 AM - 11:45 AM S17—Reliability II: A Pick of APEX 2008 Session
Moderator: David Hillman, Rockwell Collins
Our second session on reliability brings you more of the pick of APEX 2008 papers. Join us for more in depth infor-
mation on this vital topic.
42 – Global SMT & Packaging – September 2008
www.globalsmt.net
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