4
CONTENTS
Features
03 Editorial Comment
Fiscal impact continues
Industry and government should work together
14 Statistics
Warning signs for the market
iSuppli trims 2008 chip forecast
15 Cover Story
AP&S explains wafer backside protection
Wafer backside protection and thin wafer processes
18 Research News
IMEC extends research leadership
David Ridsdale reports from this year’s annual
Contents
pre-ARMM press conference
22 Semicon Europa
Transitional activities
Semicon Europa was held in Stuttgart for the last
time. David Ridsdale reports from the event
48 Business Development
Offshore development centre
CIMAC’s search for suitable locations for expansion
52 Lithography
All nodes to the challenge
The challenges of advanced process nodes with
independent mask process correction explained
57 Materials
A coat for every occasion 18
Niro explains the integration of spray drying for novel
processing of nanoparticles
66
News desk
Regional Roundup
07 ARM’s first SOI IP library
iSuppli predicts less forgiving market
09 Rochester’s recreation service
Dwindling profits and fewer opportunities to expand
11 Electrifying heartbeats
12 Attorneys hail South Korea
13 Leading the frame
Departments
COVER STORY
58 New Product Promotion
Front cover image
60 Web Listing
AP & S GmbH
61 Sources of Supply
www.ap-s.de
Cover Designed by
Mitchell Gaynor
15
www.euroasiasemiconductor.com November 2008
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