IC INDUSTRY AWARDS WINNER 2008
33
Award: FMT Final Manufacturing - Best Process
Company: NANOPLAS
Process: HDRF - dry cleaning for advanced 3D silicon integration
Website:
www.nanoplas.eu
HDRF® - Dry processing
for MEMS manufacturing
and Advanced Packaging
applications
The essence of HDRF® - High Density
Radical Flux - is the total elimination of footprint, low consumption and emissions,
any plasma induced damage. For the first scalable platforms at a low entry level
time in plasma processing, samples are no cost which far exceed other currently
longer exposed to electrical charges: there available systems. Nanoplas install base
are no ions, no electrons nor photons in includes Europe, California and Taiwan
the process chamber. for advanced flip chip activation and
isotropic etching for MEMS dry release.
HRDF® allows full process control at low
temperature environment (<100 deg. C). Potential for new applications is very
Substrates are processed in a “soft” high large thank to process flexibility and to
density flux of neutrals that is ideally the numerous benefits offered for defect
suited for the new generation of free manufacturing and high aspect ratio
embedded technologies. devices.
HDRF® technology is based upon HDRF® makes possible the integration of
Nanoplas proprietary ICP plasma source most sensitive heterogenous technologies,
that makes possible to produce 50 to 100 offering unique process capabilities and a
times more active species than wide range of chemistries.
competitive systems, making possible to
reach high throughput. HDRF® is ideally suited for 3D silicon
integration technologies.
The process is suitable for single wafer or
substrates or in batch mode using the For more information, please visit DSB 6000 Isotropic etching and
appropriate carriers. Nanoplas DSB
www.nanoplas.eu organic cleaning system
Series offer high throughput, small
IC Industry Award Winners 2008
www.euroasiasemiconductor.com
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