NEWS DESK
13
Leading the frame
Edwards largest
order ever
INTEGRATED SILICON SOLUTION, a of thermal expansion in a copper
provider of memory solutions, announced leadframe closely matches that of the EDWARDS, a supplier of vacuum and
a complete line of copper leadframe pads on the printed circuit board. abatement equipment and services,
memories including SRAM, DRAM and As a result, less stress is applied to announced one of the largest orders in the
EEPROM devices. The use of copper the solder joints due to the similar company’s history, the sale of
leadframes enhances the long term expansion and contraction rates of the approximately 100 iXH harsh process
reliability of these devices in harsh adjoining materials during temperature vacuum pumps to a major flat panel
environments such as automotive engine swings experienced in harsh manufacturer.
controls and industrial applications. environments. The pumps are intended for a
The improved reliability comes from Also, copper is not as stiff as Alloy42. manufacturing facility producing 50+
better performance in two different areas This allows the bends in the leadframe to inch LCD panels based in Asia. Delivery
when compared to the industry common minimise the stress being applied to the of the order to be made by end of 2008.
Alloy42 leadframes. First, the thermal solder joints. This greatly reduces the risk “This historic order is a clear
conductivity of copper is twelve times of a crack forming in a solder joint. vindication of the platform approach we
better than that of Alloy42. This ISSI now offers a full line of SRAMs took in developing the iXH pump,” said
translates to better heat dissipation from and EEPROMs that support operating Nigel Hunton, Edwards’ CEO. “The new
the die into the leadframe and out of the temperatures of -40C to +85C, +105C, iXH platform is based on a scalable
package. This results in less heat stress and +125C and a full line of DRAMs that architecture and a modular design with
inside the component. support operating temperatures of -40C fewer parts than our earlier pump
Since heat stress at the die is one of to +85C and +105C that are available generations.”
the leading causes of a non mechanical with copper leadframes. This allows the The iXH platform offers twice the
component failure in a long life customer to match both the temperature pumping capacity of previous Edwards
application, the copper leadframe range and the leadframe to the harsh process pumps, and it has a 25
improves the reliability of the device. application’s environment for enhanced percent smaller footprint, it is 25 percent
Second, unlike Alloy42, the coefficient system reliability. lighter, and is more energy efficient. The
platform’s design enables Edwards’
customers to respond more quickly to
GSA and NMI collaborate
emerging process requirements, while the
increases in pumping capacity and energy
efficiency helps to significantly lower tool
THE GLOBAL SEMICONDUCTOR the NMI on several initiatives and our cost of ownership.
ALLIANCE and the National organisations complement each other well At the same time, the reduction in
Microelectronics Institute (NMI), the by providing both global and regional parts reduces tool maintenance and helps
trade association representing the expertise and weíre very pleased to to extend pump life, further lowering cost
semiconductor industry in the UK and officially form an organisational of ownership for owners.
Ireland, jointly announced the signing of a alliance,” said Jodi Shelton, co-founder
collaborative MoU to form an and executive director of GSA. “Future
organisational alliance. collaboration will bring increased value
The organisational alliance sees the and resources to our global semiconductor
TSMC’s weak
GSA and NMI actively supporting each members.”-
other’s global and regional initiatives and Derek Boyd, the NMI’s Chief
October sales
activities and will focus on fostering Executive Officer said, “The
business relationships and collaboration semiconductor sector in the UK and TSMC announced its net sales for
among member companies of both Ireland has a worldwide reputation for October 2008: on an unconsolidated
organisations. In addition, the GSA and innovation and our members recognise the basis, sales were NT$28,371 million,
NMI will determine technical and value of having a global reach. This an increase of 0.4 percent over
business areas of mutual interest and alliance helps us deliver this and affords September 2008 and a decrease of
work collaboratively to address key issues the memberships of both the NMI and the 10.6 percent from October 2007.
and opportunities. GSA with even greater international Revenues for January through October
“We have already collaborated with networking opportunities”. 2008 totalled NT$289,312 million, an
increase of 13.7 percent compared to
the same period in 2007.
Tessera signs agreement with Motorola On a consolidated basis, net sales for
October 2008 were NT$29,490 million,
TESSERA TECHNOLOGIES announced litigation between the companies. If an increase of 0.6 percent over
that Motorola has signed an agreement Motorola exercises the option and takes September 2008 and a decrease of 9.6
with Tessera for an option to license the license, it will pay royalties on all its percent from October 2007. Revenues
Tessera’s chip scale packaging (CSP) products that include chips that use for January through October 2008
technology. This option enables Motorola, Tessera’s technology and are sourced from totalled NT$298,085 million, an
within a specified time period, to enter companies who are not Tessera licensees. increase of 14.0 percent compared to
into a pre negotiated license agreement Motorola is named in Tessera’s ongoing the same period in 2007.
with Tessera and settle all outstanding U.S. ITC investigation.
November 2008 www.euroasiasemiconductor.com
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