26
IC INDUSTRY AWARDS WINNER 2008
Award: Materials Enabling
Company: Advanced Diamond Technologies, Inc.
Material: Ultrananocrystalline Diamond Wafers
Website:
www.thindiamond.com
Ultrananocrystalline
Diamond Wafers
F
or decades designers and engineers extreme properties of natural diamond but are
have sought to harness the also smooth and have very low internal stresses
unsurpassed properties of diamond making them suitable for a variety of
for MEMS and electronic devices. Despite the applications. UNCD Wafers meet basic foundry
keen interest, diamond has been notoriously level standards including wafer bow, particle
difficult to work with, is prohibitively expensive count and thickness uniformity.
for mainstream applications and there hasn’t
been a reliable supply. Enter UNCD Wafers. Most MEMS devices are based on silicon due
to the availability of microfabrication
UNCD Wafers from Advanced Diamond techniques developed for the integrated circuits
Technologies, Inc. suddenly make diamond industry. Diamond has unsurpassed bulk and
affordable and accessible for MEMS and IC surface properties that exceed those of any
applications. UNCD (for ultrananocrystalline other material, and UNCD Wafers are the base
diamond) is the only phase-pure nanocrystalline material for MEMS device fabrication. The
diamond film in the world and is comprised of availability of 200 mm UNCD Wafers and
diamond grains that are as small as 5 nm in standard microfabrication techniques for
diameter - a billion-fold smaller in volume than processing (reactive ion etching) provide for the
in traditional diamond films. UNCD differs ability to manufacture diamond devices in a
from other nanocrystalline diamond films in standard foundry environment.
that other films are comprised of graphitically-
bonded material intermixed with crystalline UNCD Wafers are a critical enabling
diamond grains. UNCD, in contrast, has no technology because they provide the mechanism
amorphous or graphitic phases. UNCD Wafers for designers to begin building diamond devices
capture the hardness, modulus and other today.
www.euroasiasemiconductor.com IC Industry Award Winners 2008
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