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IC Industry Awards 2008
The nominations are...
Materials Enabling Award Wafer Processing Best Tool Award
Advanced Diamond Technologies, Inc. ASM America, Inc.
Ultrananocrystalline Diamond Wafers Pulsar 3000 ALD Module
Alchimer Aviza Technology
eG ViaCoat material for TSV metallisation Versalis fXp
Honeywell Electronic Material EV Group (EVG)
Burn-in thermal interface material 150 NanoSpray Coating System
SILECS Inc, Microcontrol
New use of spin-on dielectric materials Photopolymer film lamination system
Materials Improvement Award MATECH
Dupont/EKC Technology WaveEtch Advanced Wet Processing Tools
CuSolve EKC520 copper/low-k post etch residue remover
Rudolf Technology
Entegris Inc The NSX Series
Ultrapak Edge Guard wafer shipping box
Wafer Processing Best Process Award
Ferro Electronic Material Systems Alchimer
ILD Slurry eG ViaCoat material for TSV metallisation
Okmetic Oyj FSI International, Inc.
G-SOI - gettered SOI substrates for MEMS / CMOS processes ZETA Spray Cleaning System with ViPR Technology
Yield Management Best Tool Award Nova Measuring Instruments Ltd.
Camtek Intelligent Imaging Ltd. NovaScan 3090Next
Falcon line of automated wafer inspection & metrology systems
Replisaurus
Carl Zeiss SMT - SMS Division ElectroChemical Pattern Replication (ECPR)
E-beam Mask Repair System MeRiT MG 45
Solvay Fluor
Metryx Ltd F2 mixture for chamber cleaning
The Metryx Mentor
Surface Technology Systems plc
Sela USA, Inc. Pegasus DRIE technology for 3D packaging applications
MC600i
FMT Best Tool Award
Qcept Technologies Agilent Technologies
ChemetriQ 3000 The 4080 series of Parametric Test Systems
Yield Management Best Process Award F&K Delvotec Bondtechnik GmbH
FEI Company G5 Wirebonder
Helios NanoLab 400S
HÜTTINGER Elektronik GmbH + Co. KG
Mfg Vision HMP - DC Power Supplies
Floorvision yield management software
Kulicke & Soffa Industries
VLSI Standards, Inc. The IConnPS High Performance Wire Bonder
NanoCD Standard
Tokyo Electron Ltd
Virage Logic Corporation Precio : automated wafer prober
Self-Test and Repair (STAR) Yield Accelerator
FMT Best Process Award
Vistec Semiconductor Systems GmbH Hesse-Knipps, Inc.
LMS IPRO4 Multi-dimensional Control System
Nanoplas
HDRF- dry cleaning-advanced 3D silicon integration technologies
www.euroasiasemiconductor.com August 2008
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