NEWS DESK
13
IBM agrees to invest $1.5
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billion in New York for high-tech,
GOVERNOR DAVID A. PATERSON York State leaders for their commitment high-quality
announced significant new investments by to high tech economic development,” said
IBM and New York State, accelerating Dr. John E. Kelly III, IBM senior vice
components,
New York State’s international standing president and director of research. “These
in nanotechnology research and new investments will spur advancements
assemblies and
development and creating up to 1,000 in nanotechnology and semiconductor
tailor-made systems
new high tech jobs Upstate. The State will research and development.”
provide a total of $140 million in IBM has agreed to expand its
economic development grants, leveraging operations at Albany NanoTech and the
more than a ten to one private investment State will also provide $25 million to
of $1.5 billion from IBM. acquire state of the art infrastructure and
The investment will go toward three advanced semiconductor tooling at that
separate and complementary components location, resulting in the creation of 325
of a comprehensive project, supporting new research and development jobs.
the nanotechnology chip computer To build on the successes at Albany
activities of IBM: the expansion of IBM’s NanoTech, the State will invest $50
operations at the College of Nanoscale million toward the establishment of a
Science and Engineering at the University new, 120,000 square foot semiconductor
at Albany (Albany NanoTech), the packaging centre at a to be determined
creation of a new, advanced location in Upstate New York. This centre
semiconductor packaging research and will be established, managed and owned
development centre and the upgrading of by the College of Nanoscale Science and
IBM’s East Fishkill facility. Engineering, with IBM conducting
The three projects will collectively operations at that site.
advance nano chip technologies, including Today’s agreement will also help IBM
cutting edge chip design, demonstration, retain more than 1,000 key
and testing which all takes place at semiconductor jobs at its East Fishkill
Albany NanoTech. Nano chips each carry plant. The company has agreed to provide
billions of transistors, and applications significant resources to upgrade that site
include high end personal computers and with state of the art technology. The State
laptops; high performance servers and will additionally provide $65 million
supercomputers; virtual reality and toward that effort.
electronic games; medical devices and IBM intends to extend its investments
components; fast telecommunications to meet the increasing challenges of
devices; sensor on a chip systems for anti producing future semiconductor chips
terrorism and soldier in the field remote with smaller geometries, and to develop
monitoring and sensing. the advanced packaging technologies.
“This agreement demonstrates the Semiconductors have become increasingly
potential of public private academic sophisticated to meet growing demand for
From planning
collaboration. IBM applauds the bold advanced computer systems,
leadership of Governor Paterson, Senator telecommunication devices and complex
to production
Bruno, Speaker Silver and other New and digital consumer electronic products.
Rohm and Haas opens Asia
technical centre
Oerlikon Mechatronics AG
Hauptstrasse 1a
Rohm and Haas Electronic Materials metrology in class 10 and class 1000
P. O. Box 128
has announced the opening of its new Asia cleanroom facilities with room for future
CH-9477 Trübbach
Technical Centre (ATC) in Hsinchu, expansion. Developed to support
Tel. +41 81 784 64 00
Taiwan. The ATC allows CMP semiconductor manufacturers, the ATC is
Fax +41 81 784 64 01
Technologies to collaborate more closely currently engaging with key customers for
with Asian based customers to help advanced technology and next generation
info.mechatronics@oerlikon.com
optimise advanced CMP processes and CMP applications such as advanced node
www.oerlikon.com/mechatronics
consumable sets, as well as provide 32nm and 22nm ultra low K Cu, shallow
engineering and technical support trench isolation (STI), Tungsten (W)
throughout the Asia-Pacific region. polish and interlayer dielectric (ILD). The
The ATC features an applications ATC also houses CMP Technologies’
laboratory offering 300 mm CMP Applications Engineering and Technical
polishing capability and 300 mm Service Groups for the regioin.
August 2008 www.euroasiasemiconductor.com
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