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COVER STORY
15
Failure analysis services
New and more advanced equipment can give a company
a significant advantage in manufacturing processes.
Kees Revenberg of MASER Engineering describes their
new test and diagnostic tools.
T
he fabless semiconductor business model creates a
constant flow of innovative companies. They are
successful in creating new innovative semiconductor
applications by focusing on the application design. All their
financial strength and manpower is directed towards the
integrated circuit design, application software development and
product implementation support. A successful acceptance of the
new application can create high volume IC sales. Modern high
density electronics require advanced manufacturing facilities in
the total supply chain. Today, the investment, manpower and
know how to integrate this in one company is becoming
increasingly prohibitive. Therefore, specialised service providers
offer the necessary high tech facilities for advanced CMOS wafer
fabrication and device packaging and test. The fabless
semiconductor IC manufacturers can outsource their volume
manufacturing flow to these service providers. What remains is
the control of the flow by product and quality engineers and
assurance of product qualification and field return support. The
increasing complexity of products however, requires more
specialised tools and know how. The same drive to outsource the DCG systems OptiFIB IV circuit edit system for <90nm Cu
main IC manufacturing flow is becoming valid for specialised technology, front and backside chip modifications
qualification tasks and because of the high cost specialised
equipment and capability necessary for failure analysis of 90 nm
and below copper CMP technology and for devices with smaller Test and diagnostics tools for ESD/LU,
dimensions. The justification of an in house full range IC qualification and F/A
qualification and F/A lab is getting more difficult. The load of IC production test is linked to the mainstream output of the
the individual systems is not sufficient for a profitable operation. assembly line for the specific product. These ATE systems are
This has a negative influence on the decision to invest in newer operated in a 24/7 regime. ATE system access for product
tools in order to stay in line with the device technology. The engineering, field return analysis or further F/A tasks does not fit
solution is to outsource qualification test and failure analysis to in a production environment very well. In several instances,
independent service providers. These ISPs can offer the high end product engineering departments own a dedicated ATE system
equipment, engineering competence and experience and full for test programme development jobs, product engineering and
independence to give the highest level of unbiased engineering F/A. MASER Engineering is offering both shared ATE access
support at the right price. and a Verigy/Inovys Ocelot ZFP test system for structural testing
MASER Engineering has recently expanded their test and and ATE fault vector simulation during F/A projects. This test
diagnostic services with more than 15 advanced tools for test system is dedicated for qualification read point testing and
and failure analysis of integrated circuits based on copper CMP failure analysis. Another continuous challenge for the IC design
technology, low-K dielectric layers and device geometries of and process engineers is the development of a proper ESD
90nm or smaller. These facilities are available including qualified protection. MASER Engineering has expanded the Thermo
staff of engineers. The expansion of the MASER Engineering KeyTek Mk.2 and RCDM line of ESD and Latch-Up test
test and F/A services addresses four main issues with the new capabilities with automatic test systems for high pin count
technology nodes: devices, meeting HBM, MM and CDM standard requirements.
xrhombus decreasing feature size MASER Engineering also has a specialised ESD gate leakage
xrhombus new materials for conductors and isolators test capability. MASER Engineering has built numerous package
xrhombus more functions on a chip interfaces for a wide range of customers during the years we are
xrhombus more complex packaging active in ESD/LU testing. The latest addition is a high voltage
August 2008 www.euroasiasemiconductor.com
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