EVG FinalDr 1/3/10 12:35 Page 19
Nanoimprint Lithography
Issue I 2010
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Figure 12: SEM image of 50 nm hot embossed Figure 14: SEM image of 50 nm and 100 nm hot
lines (100 nm in height) utilizing working embossed meander structures (100 nm in height)
stamps utilizing working stamps
imprinting processes were performed by using imprinted substrate. This was solved by the use
the spin-on resist mr-I-8030 from micro resist of high resolution working stamp with low
oasiasemiconductor
technology with imprint temperatures of 130°C adhesion force to the polymer surface.
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at 5 kN contact forces. Working stamps can be used multiple times
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All features could be completely resolved as and offer therefore a cost of ownership
depicted in figures 10 to 13. These figures show advantage over processes using the master
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different high resolution embossed resist stamp directly. The dependence of the imprint
structures ranging from 300 nm down to 50 nm temperature and the imprint force was evaluated
on different locations on a Si substrate. The with cyclo-olefin-copolymer substrates.
atomic force microscope (AFM) picture shown in Features ranging from 30 µm to 300 µm
figure 9 demonstrates 300 nm diameter dots with feature heights of up to 200 µm could be
with imprint depths of 100 nm. demonstrated with high pattern fidelity.
Five different processes have been realized Imprinted spin-on layers with high resolution
by either in optically aligned mode or in first features down to 50 nm were shown. The
print quality. One of the key process steps is the targeted applications for the EVG 750 are micro-
automated separation of the stamp from the fluidics and bio-sensing devices.
References
[1] N. Ross,
et.al., Nanoimprint Lithography with a lithography in a highly transparent and chemically resistant
Commercial 4 Inch Bond System for Hot Embossing, Proc. cyclo-olefin copolymer (COC), Journal of Micromech.
SPIE 4343, (2001), 427-435. Microeng. 15 (2005) 296-300.
[2] Mizuno, et. al., Fabrication of novel type microfluidic
devices by hot embossing technology, Proceedings of the 9th Authors
International Conference on the Commercialization of Micro T. Glinsner, , G. Kreindl, T. Wieser, C. Thanner, D. Treiblmayr,
and Nano Systems, August 29- September 2, 2004, R. Miller, P. Lindner from the EVGroup.
Edmonton, Alberta, Canada, pp. 389 -392. T.Veres, K. Morton, E. Roy, from the Industrial Materials
[3] Neil S. Cameron,
et.al., Hot Embossing Lithography : Institute, National Research Council Canada
Release Layer Characterization by Chemical Force Microscopy,
Mater. Res. Soc. Symp. Proc. Vol. 872, 2005. Acknowledgement
[4] P.Dorsey, et. al., Discrete Track Recording (DTR) Media The authors acknowledge research funding from the
Fabricated using Nanoimprint European Initiative program LabonFoil,
www.labonfoil.eu.
[5] S. Merino,
et.al., The use of automatic demolding in
nanoimprint lithography processes, Microelectronic Reprinted with permission from T. Glinsner et al., J. Vac. Sci.
Engineering 84, (2007), 958-962. Technol. B 28(1) 36, (2010). Copyright 2010, American
[6] A microfluidic dye laser fabricated by nanoimprint Vacuum Society.
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