The new epoxy Die Bonder 2100 xP
Revolutionizing
die attach
Unsurpassed speed at 20 µm accuracy
Fastest time to yield
Leading edge machine concept
Platform of the future
Highest uptime
As one of the leaders in die attach for more than two decades, Oerlikon Esec
is committed to surpassing its customers’ needs by designing the most innovative
and revolutionary die attach platform.
Learn more about the revolution in die attach on our website:
www.oerlikon.com/esec/revolution
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