Company News
Testing 3D devices
PRESTO ENGINEERING and CEA-Leti have announced that they have begun a three-year collaboration to develop test and analysis capability for 3D semiconductor devices. The project, a common lab that will include Presto’s new R&D center at CEA-Leti, will focus on extending the company’s test, reliability and failure analysis solutions to through-silicon vias (TSVs). “IDMs and fabless companies are
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increasingly outsourcing critical test and analysis functions. The adoption of 3D technologies will fuel this trend and product engineering will require new skills, reliable processes and specialized equipment,” said Michel Villemain, CEO of Presto Engineering. “CEA-Leti has industry-leading expertise in 3D integration, advanced interconnects and TSVs, and by working side by side with CEA-Leti’s experts.” Presto’s R&D program with CEA- Leti is focused on characterization of TSVs reliability, defect susceptibility and electrical performance aspects,
ASML results boost European stocks
ASML HOLDING NV (ASML) has announced 2010 first quarter results according to US GAAP with Q1 2010 net sales of EUR 742 million versus Q4 2009 net sales of EUR 581 million. Q1 2010 net income was EUR 107 million, or 14.5 percent of net sales, versus a Q4 2009 net income of EUR 50 million or 8.7 percent of net sales. “Our first quarter 2010 sales rose to above EUR 740 million and bookings came in at EUR 1 billion, in line with our expectations and adding confidence in a prolonged recovery of the industry,” said Eric Meurice, President and Chief Executive Officer of ASML. “To enable our customers’ next technology nodes, we have now shipped nine of our most
identifying existing test protocols that are appropriate for 3D structures while developing new ones to meet new challenges, and bringing up new diagnostic methods or tools to identify root cause of failures. The common lab will make the ATE and debug process as well as the product engineering platform available for third parties. “This partnership with Presto is a natural complement to CEA-Leti’s many 3D integration projects and joint labs,” said Laurent Malier, CEO of CEA-Leti. “We will identify the key challenges of
3D product engineering, so semiconductor manufacturers will have reliable test and analysis options when they are ready to go to market with 3D devices that feature TSVs.” In addition to its broad goals, the joint lab will enable Presto to develop critical test and analysis techniques, such as probing specific areas of TSVs without affecting the device itself. “Testing 3D-IC prototypes will
require detecting, recognizing and understanding the failure modes, and mechanisms through their electrical signature,” said Cédric Mayor, R&D director for Presto Engineering Europe, a subsidiary of Presto Engineering Inc. “Faulty TSVs may have many root causes that have to be investigated and catalogued in such a way that our ultimate test program and diagnostic tool detect them efficiently.” Presto offers enhanced RF and 3D- integration expertise and advanced test, reliability, fault-isolation and failure-analysis services. Its Design Success Analysis offering includes first- silicon validation, as well as characterization of new processes, new designs, and process transfers.
advanced TWINSCAN dual stage scanner, having proven critical dimension (CD) imaging uniformity well below 1 nanometre (nm) and overlay of less than 2 nm. By the end of the quarter we had 28 NXT:1950i systems in backlog and expect to ship 11 in Q2 2010. In parallel, we continue to make good progress with EUV lithography.” In Q1 2010, ASML’s net sales of EUR 742 million included 23 new and 11 used systems, totalling net system sales of EUR 632 million, and net service and field options sales of EUR 110 million. Net system sales for Q4 2009 included the shipment of 19 new and 6 used machines, totalling EUR 432 million, and net service and field options sales of EUR 149 million. The Q1 2010 average selling price for a new system was EUR 25.8 million, compared with the Q4 2009 average selling price for a new system of EUR 19.7 million. The Q1 2010 average selling price for all ASML systems sold was EUR 18.6 million, compared with the Q4 2009 average selling price of
EUR 17.3 million. Q1 2010 net bookings totalled 50 systems valued at EUR 1,004 million, including advanced immersion systems for critical layers as well as KrF systems for less critical layers mainly ordered by Foundry customers for capacity additions. ASML’s order backlog as of March 28, 2010 was EUR 2,170 million, totalling 85 systems with an average selling price of EUR 25.5 million. ASML’s backlog as of December 31, 2009 was valued at EUR 1,853 million, totalling 69 systems with an average selling price of EUR 26.8 million.
www.euroasiasemiconductor.com Issue II 2010
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