Materials
Applications
There are many potential applications, in addition to those highlighted above, for diamond devices that leverage wafer-scale processing. Due to the combination of wear resistance and optical transparency, diamond is potentially the key material for use as the master stamp for nano-imprint lithography. Diamond grit and diamond-like-carbon are already used extensively to condition pads used for CMP processing. Companies have begun to move to CVD diamond technologies to improve pad design for future nodes. Many companies are providing diamond-coated or monolithic diamond atomic force microscope (AFM) probes to eliminate the need to continually replace broken or contaminated tips. This advance may lead to AFM from a research lab technique to become an in-line measurement tool. Although thin film diamond isn’t currently available in foundries, diamond-on-silicon wafers can be sourced from several companies that support custom development and provide volume production of prototype wafers. Advances in material compatibility and process integration allow for insertion of diamond processes at multiple points within a traditional MEMS or CMOS flow. A diamond process module is available through the MEMS and
Figure 4. This process sequence demonstrates the creation of a freestanding diamond membrane structure
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Nanotechnology Exchange as well.
Summary
Figure 3. (a) (b) (a) As-deposited ultra nanocrystalline diamond, approximately 7 nm root mean square (rms) roughness (b) After CMP of ultra-nanocrystalline diamond, less than 1 nm rms roughness
CVD diamond has finally arrived as a thin film technology capable of supporting wafer-scale fabrication of devices enabled by the numerous superlative materials properties of diamond. Integration strategies and design rules now exist that allow diamond to integrate with advanced semiconductor materials to develop microdevices with multifunctional capabilities. Academic work in the US, Europe, and Asia have provided numerous examples of possible applications for diamond in sensors, electronics, thermal management, quantum computing, and many other areas. Diamond has now entered a stage in which it can be regarded as a true engineering material, whose properties can be optimized for real-world applications that leverage wafer-scale manufacturing of high- margin products.
www.euroasiasemiconductor.com Issue II 2010
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