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Lithography

Vibration and Throughput:

The Yield-Killers

As manufacturers scale down towards 22 nm and beyond, vibration control becomes an increasing challenge to throughput and yield. Especially during the lithographic stage were precision is imperative. Wes Wigglesworth of Technical

Manufacturing Corporation and Scott Jordan of Physik Instrumente (PI) discuss

how nano scale imaging & fabrication advances will be driven by piezoelectric active vibration control.

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A

Figure 1. 45nm line- width test patterns produced with an advanced Immersion Lithography System at SE-MATECH in Austin, TX. (Left): Pattern is obliterated by floor vibration. (Right): STACIS isolation enables crisp, accurate

photolithography. (Images obtained via SEM.)

ctive vibration isolation technology is a key ingredient for enabling next-

generation, 22nm scale lithography. Based on digital signal processing algorithms and responsive piezo technology with the latest ultra-reliability enhancements, patented STACIS active isolators have proven their dependability in mission-critical fab deployment for over a decade. This technology is now also available in small form-factors ideal for emerging applications ranging from advanced microscopies to nanomanufacturing.

The semiconductor industry is ruled by two unbreakable laws. Moore’s Law, Equation 1, describes the exponentiating density of integrated circuit elements with time.

Equation 1. Moore’s Law observes a doubling of device density every 18 months.

Meanwhile, Equation 2, defines a term describing nanoscale processing in the face of the fundamental economic constraint of “time is money.”

Equation 2. The economic imperative of “time is money” necessitates more devices per cm2, larger area processing and faster cycle times.

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