Implant Stripping
20
Steam injection for uniform wet stripping
Implanted photoresist is difficult to
remove from a wafer in progress and often leads to material loss during
production. Dan Syverson, Corporate Marketing Manager at FSI International
discusses how steam injecting a sulphuric acid
hydrogen peroxide mixture minimizes material loss and ensures critical uniformity in all wet stripping of implanted photoresist.
www.euroasiasemiconductor.com Issue II 2010
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