Materials
Diamond slims down
12
Diamond is an obvious choice of material when looking for electron mobility or hardness but it has not been easy to manufacture.
Diane P. Hickey, Ph.D. & John A. Carlisle, Ph.D. of Advanced Diamond
Technologies discuss the advances that have been made allowing diamond to become the next big thing in micro manufacturing.
D
iamond is the ultimate material, superior in terms of hardness,
modulus, electron mobility, dielectric strength, index of refraction, optical transparency (IR-UV), thermal conductivity, friction, biocompatibility, corrosion resistance, negative electron affinity, and chemical inertness. Advances in chemical vapour deposition (CVD), manufacturing technology, and processing know-how enable diamond thin films to be integrated into a wide spectrum of innovative products that leverage wafer-scale processing. This article describes the major design rules and integration strategies used to make diamond microdevices. A number of fundamental capabilities are now accessible to the device designer enabling diamond to be adopted by the semiconductor industry, including:
Diamond wafers (or wafer-scale diamond):
commercially available thin, smooth diamond films which are uniform in properties and available on 300mm wafers
Integration into today’s semiconductor
processes: pathway to flow integration, chemical mechanical polishing (CMP), and lithographic patterning (i.e., etching) allow integration with current semiconductor equipment and processing
Metallization and electrodes: integration
with metals and the formation of stable ohmic or Sckottky contacts, a must for active devices
Integration with advanced materials:
extensive research allowing diamond to be easily integrated with currently accepted semiconductor materials
Wafer bonding: enables complex device structures
www.euroasiasemiconductor.com Issue II 2010
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