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VENDORVIEW
Wet Wafer Separation:
Efficiently automated
With the solar industry seeking incremental improvements to move towards grid parity.
Improving the manufacturing process is a key area of focus for the industry but
improvements can be made at any aspect of the manufacturing process. AMB discuss
how companies can improve their costs and output by improving the automated
processes throught their fabrication facilities.
A
MB Apparate + Maschinenbau GmbH optimizes productivity. In the last work stage, the
is specialized in developing and wafers are transferred to the final cleaning station.
manufacturing automated systems to handle and During the entire sequence, humidifiers prevent dry
transport wafers through several process steps of spots on the wafers. The water bath is continuously
wafer- and cell manufacturing. The new Wet Wafer refreshed by a circulation device with integrated
Separator WWS 3000+ addresses the critical filter. The Wet Wafer Separator delivers high quality
handling and sorting of thinnest wafers between wafers to the subsequent process steps.
the process steps pre-cleaning and final cleaning.
Wafer damage and breakage is reduced to a Main functionalities at a glance
17
minimum. High efficiency separating units ring6 Separation of pre-cleaned wafer stacks
combined with wafer control and buffer systems
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ring6 Transfer into cassettes or inline cleaning system
guarantee high production and yield. ring6 Automatic fracture identification
.solar
ring6 Double wafer screening
Main Benefits
-pv-management.com
ring6 Wafer traceability
ring6 High throughput ring6 Dual loading system
ring6 Reduced breakage rate
ring6 Quality control Applications
ring6 Seamless wafer handling ring6 Wafer type: Multi- and Mono-crystalline silicon
ring6 Wafer traceability ring6 Wafer geometry: Square and pseudo-square
ring6 Wafer thickness: 150 - 300 micro meters
A lean and automated process ring6 Throughput: > 3000 Wafers per hour
Issue III 2009
In the first work stage the carriers are lowered into
the water bath. A feeder system transports the
stack of wafers automatically to the pickup point.
The newly developed pickup system separates the
foremost wafer from the stack without any
mechanical stress. After separation, the wafers are
moved out of the water bath to the transfer station
along a special conveyor belt with a non-slip
surface. This belt creates a large surface contact
with the wafers, guaranteeing a gentle transport.
The transfer station is followed by the automatic
fracture identification and double wafer screening
system with its integrated ejection mechanism. In
a first step broken wafers are sorted out just by
using gravity. An inspection camera ensures the
detection of damaged wafers. The following
double wafer control is done by a contact-free
infrared system. The wafers are transferred either
to a 1 – 8 line Inline system or to cassettes,
depending on the manufacturing process. A buffer
system coordinates the production flow and
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