Regional News
China chip challenge
ONCE the world’s fastest growing chip iSuppli. “The establishment of a strong
manufacturing region, China hit an all Chinese semiconductor industry was
time low in the first quarter of 2009, considered an essential element. The
with nearly 60 percent of the nation’s plan collapsed as global sales dried up.
semiconductor manufacturing capacity Semiconductor manufacturing has
unused, according to iSuppli Corp. turned out to be a financial burden.”
Manufacturing utilisation in China fell to China’s investments in the sector
43 percent in the first quarter, the have not provided the returns that
lowest level since iSuppli began were forecast. Adding to China’s industry will look very different from
tracking the market in 2000, and a dilemma is the overestimation of how it has in the past.
massive drop from a recent high of 92 capacity, which was expected to be “Since Chinese manufacturers do
percent in the second quarter of 2004. shuttered in other regions in favor of not possess a differentiation from their
This rock-bottom utilisation rate comes lower cost Chinese manufacturing. competitors, they are at a
Issue III 2009
as a direct result of low demand “With the addition of the current disadvantage,” Jelinek said. “This will
square4
spurred by the global economic global economic recession, China’s lead to mergers and consolidations.”
.com
downturn. However, the utilization focus has shifted from establishing With iSuppli not forecasting a
plunge indicates that China’s long manufacturing independence to recovery for Chinese manufacturers
nurtured goal of establishing a vibrant restructuring its entire chip industry until 2012, it is unlikely that weak
domestic semiconductor production before it simply collapses.” companies can survive two years in the
industry is in serious jeopardy. China’s utilisation is expected to face of a negative cash flow. iSuppli
“During the last 10 years, the rise moderately through the rest of the anticipates the first merger in China’s
Chinese government has worked to year, but will remain very low at 54 industry will be in the second quarter of
oasiasemiconductor
develop a domestic economy that percent in the fourth quarter of 2009. 2009. This will signal that time is of the
.eur
would provide the nation with Over the longer term, utilization will essence if companies are going to to
www
economic independence,” said Len rebound to 84 and 85 percent in 2012 weather the storm. iSuppli anticipates
Jelinek, Director and Chief Analyst for and 2013. However, when utilisation that by the 2nd half of 2010, a smaller,
9
semiconductor manufacturing at recovers to these levels, China’s industry will emerge in China.
3D IC Control
Japanese IC
Rudolph has joined SEMATECH’s 3D
merger talks
Interconnect Program at the College of
Nanoscale Science and Engineering
(CNSE) of the University at Albany. The Renesas and NEC are holding
partnership is a continuation of efforts discussions about a merger that will
in process characterization, with a new occur between the two Japanese
focus on 3D IC processing and process defect detection, characterization, and companies that will create the
control of TSV manufacturing. data analysis will be significant in world’s third largest chipmaker. The
Rudolph’s technologies will be developing technologies and processes two are planning the move in hopes
applied to various projects including via for 3D TSV processes.” of weathering global economic
depth and CD metrology, metallization Richard Brilla, VP for strategy, concerns. The deal will cause a major
void detection, stacked wafer via alliances and consortia at CNSE, said, shake up of the Japanese industry as
alignment, wafer edge defect detection “The addition of Rudolph Technologies’ local competition will consider
and bump height coplanarity. metrology and characterization similar moves. Reports suggest the
“The advanced device design and capabilities will enhance the research Japanese government welcomes the
complex manufacturing requirements of being conducted as part of move. The companies are expecting
3D packaging opens a new frontier of SEMATECH’s 3D Interconnect Program combined losses of 265B yen for
process control challenges,” stated at CNSE’s Albany NanoTech. At the 2008 for semiconductor activities.
Ardy Johnson, Rudolph’s Vice President same time, it will build on the research Both companies have executed
of Marketing. and development at the UAlbany capital saving programmes to deal
Sitaram Arkalgud, Director of 3D NanoCollege, which is providing critical with the losses and any merger
interconnect at SEMATECH added, solutions for the world’s leading would see a rationalising of
“We are pleased to welcome Rudolph companies in the highly competitive resources for the new venture.
as a partner. Rudolph’s expertise in global nanoelectronics industry.”
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