Industry News
Alliance moves to 28nm
IBM, Chartered Semiconductor, behalf of the technology alliance.
GLOBALFOUNDRIES, Infineon , Preliminary results indicate that the
Samsung and STMicroelectronics have 28nm platform can provide a 40%
defined and are developing a 28 nm, performance improvement and a more
high-k metal gate (HKMG), low power than 20% reduction in power all in a
bulk CMOS process technology. The chip that is half the size compared with
low power, 28nm platform can provide 45nm. The high-k metal gate
power performance and time to market implementation allows one of the
advantages for producers of a broad industry’s smallest SRAM cells at 0.120
range of power sensitive mobile and square microns, with low minimum
consumer electronics applications. The voltage operation and competitive
favourable leakage characteristics of performance, leakage and stability.
the HKMG technology result in “This statement of commitment to
Issue III 2009
optimised battery life for the next 28nm low power technology by the
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generation of mobile products. This Alliance is an important progression
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represents an extension of existing from 32nm high-k metal gate executive VP and GM, physical IP
joint development agreements. technology,” said Jorgen Lantto, Chief division, ARM. “We believe this
A 28nm low power technology Technology Officer of ST-Ericsson. announcement is an advancement of
evaluation kit was previously made “28nm low power will provide a the HKMG technology to enable
available in December 2008 to early significant step function versus the designs and speeds time to market.”
access clients, followed by release in 40nm node, enabling competitive Unlike poly/SiON, the HKMG low
March 2009 of an evaluation kit for solutions for segments served by power technology breaks down the
oasiasemiconductor
open access to the general STMicroelectronics,” said Jean-Marc barrier of scaling, allowing power and
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marketplace. Early risk production is Chery, executive VP, CTO of STMicro. performance advantage without the
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anticipated in the second half of 2010. In September 2008, ARM and the need for complex processes, thereby
Already working with clients on 32nm Common Platform alliance (IBM, lowering clients’ total development
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low power technology, the alliance has Chartered and Samsung) announced a cost. This announcement marks the
gained valuable experience in the collaboration agreement to develop a latest development achievement from
implementation of HKMG technology, comprehensive 32nm and 28nm SoC this alliance of semiconductor
and is offering a migration path from design platform. manufacturing, development and
32nm to 28nm technology. “Through collaboration and technology companies who collaborate
“Through this collaboration, IBM integration of processor and physical IP, to address the product design and
and partners are helping accelerate ARM and the Common Platform advanced process development
development of next generation alliance continue to drive the adoption challenges central to producing a
technology,” said Gary Patton, VP for of next generation consumer smaller, faster, more cost efficient
IBM’s Semiconductor R&D Centre on electronics,” said Simon Segars, generation of semiconductors.
Worldwide equipment spending slump
WORLDWIDE SEMICONDUCTOR capital equipment made possible by strong demand for high-priced 193-nm
spending totalled $30.7 billion in 2008, a 31.7 per cent DUV immersion steppers. Teradyne jumped into the top 10
decline from the previous year, according to results by and captured the No. 1 spot in the test markets. The
Gartner. In major segments, wafer fab equipment declined packaging assembly equipment (PAE) market totalled $4
32.8 per cent, while back-end equipment decreased 27.2 billion in 2008, a 24.5 per cent decline from 2007. More-
per cent, both hit hard by reductions in capital spending. traditional die-level packaging (DLP) equipment took the
Analysts said that early in 2008, it was obvious that brunt of the decline, as interconnect and die bonder sales
excessive memory spending in prior years had resulted in declined more than 30 per cent. In the automated test
untenable financial conditions for memory suppliers. Then equipment segment, sales fell more than 31 per cent in
came the global economic meltdown in the third quarter, 2008, resulting in a total market size of $2.4 billion. The
which caused most spending plans to be put on hold. Asia/Pacific region remained the biggest consumers of test
In 2008, the top six companies remained the same as in equipment at nearly 22 per cent share as system-on-chip
2007. Applied Materials maintained the No. 1 position, (SoC) test and radio frequency (RF)-related test remained
accounting for 13.2 per cent of the worldwide market, strong. The memory test demand segment declined 60 per
despite a 39.8 per cent decline in revenue. ASML replaced cent in 2008. The bright spots were the SoC- and RF-test-
Tokyo Electron as the No. 2 company. ASML’s advance was related equipment markets.
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