Honeywell PCM45F
Pad Format,
PCM45F-SP Print-
Thickness
able and TM200
™
TIM 2 APPLICATION
(Application Thickness):
Phase Change
PCM45F Pad Format 0.0015”
A QUICK GUIDE TO
Interface Material:
PCM45F-SP Printable 0.0015”
HONEYWELL THERMAL TM200 0.0015”
PCM45F Pad Format,
PCM45F-SP Printable
INTERFACE MATERIALS
Softness
Thermal Conductivity
(Typical value):
(Typical value):
PCM45 Series 5 to 30 psi
(plastically flows)
TIM 1 APPLICATION
PCM45F Pad Format 2.35 W/˚C
TM200 5 to 30 psi
Phase Change
PCM45F-SP Printable 2.35 W/˚C
Honeywell PCM45F
TM200 3.0 W/˚C
(plastically flows) Interface Material:
PCM45F Pad Format,
Pad Format,
Thermal Impedance
PCM45F-SP Printable
(Typical value):
Thermally
PCM45F-SP Print-
(“Typical values” are not to
PCM45F Pad Format 0.08˚C cm
2
/W
be considered performance
Conductive Gel:
PCM45F-SP
Thickness
Printable
able and TM200
™
0.08˚C cm
2
/W
specifications.)
TIM 2 APPLICATION TM200
TM200
(Application Thickness):
b0.20˚C cm
2
/W
Phase Change
PCM45F Pad Format 0.0015”
A QUICK GUIDE TO
Interface Material:
Semicon West continues to thrive Patented PCM45F* Pad Format
PCM45F-SP Printable 0.0015”
PCM45F-SP Printable Patented TM200**
HONEYWELL THERMAL TM200 0.0015”
PCM45F Pad Format,
Phase Change Material in Differ
PCM45F-SP
ent Shapes
Printable
Applied to a Thermal Lid
INTERFACE MATERIALS
Softness
Nextreme has developed a thin film
Thermal Conductivity
(Typical value): material that freezes instantly by applying
current. The patent pending material was
(Typical value):
PCM45 Series 5 to 30 psi
developed in cooperation TIM with 1 JPL APPLICAand pad TION
PCM45F Pad Format 2.35 W/˚C
(plastically flows)
TM200 5 to 30 psi
format phase change material Research.
Phase Change
PCM45F-SP Printable 2.35 W/˚C
Honeywell PCM45F
TM200 3.0 W/˚C
(plastically flows)
Zestron demonstrated their
Interface
FAST
Material:
technology defluxing age
PCM45F
nts for bum
Pad
p
Format,
Pad Format,
Thermal EverImpedanceett Charles Technologies (ECT) wafers and flip chips. Although
PCM45F-SP
most
Printable
(Typical value):
introduced a new Zip-F interconnect packaging houses are located in Asia,
(“Typical values” are not to
Thermally
PCM45F-SP Print-
PCM45F
pogo
Pad
pin.
Format
The 2D
pin
0.08˚C
is electroformed
cm
2
/W
Zestron is looking to the designers in
by etching and is flat. ECT claim
be considered performance
Conductive Gel:
Silicon Valley to design their materials
PCM45F-SP
Thickness
Printable
0.08˚C cm
2
/W
specifications.)
TM200
able and TM200
™
this manufacturing process gives them TIM 2 APPLICATION into the manufacturing process. Zestron
TM200 (Application
tighter control
Thickness):
and
b0.20˚C
makes the
cm
2
pins
/W
more
Phase Change
has recently opened a new office in
PCM45F
scaleable.
Pad
The
Format
externally
0.0015”
mounted springs Singapore as part of their continued
A QUICK GUIDE TO
PCM 45F. Patented PCM Interface 45F Pad Format Material: Phase
Patented PCM45F* Pad Format PCM45F-SP
enables better
Printable
control of
0.0015”
the force applied PCM45F
Change PCM45F-SP Printable Material
global PCM45F-SPexpansion.
Patented TM200**
TM200
HONEYWELL THERMAL TM200
Phase Change Material
0.0015”
PCM45F Pad Format,
during testing. The Zip-F is complemented
s Super high
in Dif
packing
ferent Shapes
density,
This
s First
was
Applied to a Thermal Lid
a
printable
selection of the
phase
new
change
s Super high packing density,
by a Zip-R (radial pin) and a Zip-H hybrid
PCM45F-SP Printable
INTERFACE MATERIALS
products on display this week. I am sure
Softness
pin which
is a round at the top and flat
over 80%, conductive filler
there were
material
many more that we didn’t see.
over 80%, conductive filler
Thermal Conductivity
(Typical
at the
value):
bottom, allowing better contact
s
for
Extremely low thermal resistance s Super high packing density,
s Dispensable silicone based
(Typical value):
PCM45
BGA
Series
devices.
5 to 30 psi
Trevor Galbraith.
(plastically flows)
s 45˚C phase change TIM 1 temperaturAPPLICATIONe
over 80%, conductive filler
thermal gel
PCM45F Pad Format 2.35 W/˚C
TM200 5 to 30 psi
s Continuous Roll Format
Phase
(CRF),
Change
s Extremely low thermal resistance
s Extremely low thermal resistance
Packaging Materials
PCM45F-SP Printable 2.35 W/˚C
TM200 3.0 W/˚C
(plastically flows)
Individual Kits, Screen
Interface
Print,
Material:
Bulk
s 45˚C phase change temperature
PCM45F Pad Format,
Thermal Impedance
PCM45F-SP Printable
(Typical value):
One of the surprising conversations we had
(“Typical values” are not to
Thermally
PCM45F Pad Format 0.08˚C cm
2
/W
at the show was with Honeywell, who
be considered performance
Conductive Gel:
PCM45F-SP Printable 0.08˚C cm
2
/W
specifications.)
revealed that they supply all of the lead-
TM200
TM200 b0.20˚C cm
2
/W
For more information
Patented PCM45F* Pad Format
TIM
PCM45F
PCM45F-SP Printable
2 APPLICATION
Phase change interface material:
www.electr
PCM45F-SP
PCM
onicmaterials.com
45F-SP
Patented TM200**
. Printable in different shapes
TM200
Phase Change Material
s Super high
PCM
in Dif
packing
45F
fer
Pad
ent Shapes
Format,
density, s First
Applied to a Thermal Lid
printable phase change
s Super high packing density,
over 80%,
PCM
conductive
45F-SP Printable
filler Specialty Materialsmaterial
over 80%, conductive filler
Honeywell PCM45F
s Extremely low thermal resistance
Electr
s
onic Materials
Super high packing density,
s Dispensable silicone based
s 45˚C phase change temperature
Pad Format,
Honeywell Inter
over 80%,
national Inc.
conductive filler
thermal gel
s Continuous Roll Format (CRF),
s Extremely low thermal resistance
s Extremely low thermal resistance
PCM45F-SP Print-
Customer & Technical Support
Individual Kits, Screen Print, Bulk
s 45˚C phase change temperature
Thickness Hotline: 509-252-2102
able and TM200
™
TIM 2 APPLICATION
(Application Thickness):
Fax: 509-252-8617
Phase Change
PCM45F Pad Format 0.0015”
A QUICK GUIDE TO
Interface Material:
Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of
PCM45F-SP Printable 0.0015”
HONEYWELL THERMAL
www.honeywell.com
any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments,
TM200 0.0015”
PCM45F Pad Format,
and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials
PCM45F-SP Printable
INTERFACE MATERIALS
and processes are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe
Softness
any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required.
©2008 Honeywell International Inc. *Honeywell U.S. Patents 6,451,422 & 6,811,725 **Honeywell U.S. Patent 6,605,238 PB0260608Rev12
Thermal
PCM45F
Conductivity
(Typical value):
For more information
PCM45 Series 5 PCM45F-SPto 30 psi TM200
TM200. Patented TM 200 applied to a thermal lid
(Typical value):
s Super high packing density,
www.electr
(plastically
onicmaterials.com
s First printable
flows)
TIM 1 APPLICATION
PCM45F Pad Format 2.35 W/˚C
TM200 5 to 30 psi
phase change
Phase
s
Change
Super high packing density,
PCM45F-SP
over
Printable
80%,
conductive
2.35 W/˚C
filler material
free over solders 80%, to Tconductive amura in Japan. fillerIn
TM200 3.0 W/˚C
(plastically flows) Interface Material:
Specialty Materials
s Extremely low thermal resistance s Super high packing density,
PCM45F Pad
s
addition
Format,
Dispensable
to their PCM45
silicone
screen
based
printable
Thermal Impedance
Electronic Materials
PCM45F-SP PrintableTIM2 material, they have introduced a
(Typical s value):45˚C phase change temperature
over 80%, conductive filler
thermal gel
(“Typical values” are not to
Thermally
dispensable, polymer/metal hybrid TIM1.
PCM45F
s Continuous
Pad Format
Roll
0.08˚C
Format
cm
2
/W
(CRF),
be considered
Honeywell Inter
performance
s Extremely national Inc.low thermal resistance Conductive
s
Further
Extr
Gel:
emely
developments
low thermal
are imminent
resistance
from
PCM45F-SP
Individual
Printable
Kits,
0.08˚C
Scr
cm
2
een
/W
Print,
specifications.)
Bulk
Customer & T s 45˚C echnical Supportphase change temperature
TM200
TM200 b0.20˚C cm
2
/W
Honeywell around October.
Hotline: 509-252-2102
Patented PCM45F* Pad Format PCM45F-SP Printable Patented TM200** Kyzen demonstrated their award-winning
Phase Change Material in DifFax: 509-252-8617ferent Shapes
TIM 1 APPLICATION
Applied to a Thermal Lid
Although all
Aquanox
statements and information contained
4241, a batch-cleaning chemistry
herein are believed to be accurate and reliable, they are presented without guarantee or warranty of
www.honeywell.com
Phase change interface material:
any
used
kind, expr
for
ess
screens
or implied.
and
Information
stencils.
provided
The
her
Aquanox
ein does not relieve the user from the responsibility of carrying out its own tests and experiments,
and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials
PCM 45F Pad Format, and 4241 processes won are the made Cleaning without reprChemistries esentation or warranty that any such use is free of patent infringement and are not recommendations to infringe
For more information
PCM 45F-SP Printable
any
category
patent. The
in
user
the
should
Advanced
not assume
Packaging
that all toxicity data and safety measures are indicated herein or that other measures may not be required.
©2008 Honeywell International Inc. *Honeywell U.S. Patents 6,451,422 & 6,811,725 **Honeywell U.S. Patent 6,605,238 PB0260608Rev12
www.electronicmaterials.com Thermally Conductive Gel: TM200 Awards and was runner-up in the Flip Chip
Equipment and Materials category.
Specialty Materials
Electronic Materials
Honeywell International Inc.
60 – Global SMT & Packaging - August 2008
www.globalsmt.net
Customer & Technical Support
PCM45F
Hotline: 509-252-2102
PCM45F-SP TM200
s Super high packing density, s First printable phase change s Super high packing density,
over
Fax: 509-252-8617
80%, conductive filler material over 80%, conductive filler
Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of
s Extr
www
emely
.honeywell.com
low thermal resistance s Super high packing
any kind,
density
express or
,
implied. Information s prDispensable ovided herein does silicone not relieve based the user from the responsibility of carrying out its own tests and experiments,
and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials
s 45˚C phase change temperature
over 80%, conductive
and processes
filler
are made without representation
thermal
or warranty
gel
that any such use is free of patent infringement and are not recommendations to infringe
any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required.
s Continuous Roll Format (CRF),
s Extremely low
©2008 Honeywell Inter
thermal resistance
national Inc.
*Honeywell U.S. Patents 6,451,422 & 6,811,725 **Honeywell U.S. Patent 6,605,238 PB0260608Rev12
s Extremely low thermal resistance
Individual Kits, Screen Print, Bulk s 45˚C phase change temperature
For more information
www.electronicmaterials.com
Specialty Materials
Electronic Materials
Honeywell International Inc.
Customer & Technical Support
Hotline: 509-252-2102
Fax: 509-252-8617
Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of
www.honeywell.com
any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments,
and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials
and processes are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe
any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required.
©2008 Honeywell International Inc. *Honeywell U.S. Patents 6,451,422 & 6,811,725 **Honeywell U.S. Patent 6,605,238 PB0260608Rev12
A QUICK GUIDE TO HONEYWELL
THERMAL INTERFACE MATERIALS
Honeywell PCM45F Pad Format,
PCM45F-SP Printable and TM200
™
Thermal Interface Materials
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