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SMTA International 2008 Show Preview
preview
SMTA International 2008
The 2008 SMTAI Conference and Show is being held at Disney’s
Coronado Springs Resort and Convention Center, right on the
Disney World property in Orlando, FL, from August 17–21 and
will include a larger exhibition floor than in its inaugural year.
SMTAI 2008 will also offer 24 courses, Technology Showcase. Participate in show, recognizing the very best new
100 technical papers and four symposiums, free forums and events each day. And innovations in the printed circuit
along with panel discussions, real-time experience the magic of Disney! assembly and packaging industries over
chat rooms, and the opportunity to Global SMT & Packaging will be the past year.
network with experts. View equipment presenting its fourth annual Global Here are just some of the FREE
from today’s leading suppliers at the Technology Awards during the events you can look forward to:
Welcome Reception
Tuesday, August 19 | 5:00pm – 6:30pm, Exhibit Floor
A Mexican Fiesta! This is your opportunity to network with your colleagues and meet new friends. Enjoy hors d’oeuvres and a
drink. This is a great opportunity to continue unfinished business, or just relax and unwind after a busy day at the conference or in
the exhibit hall.
Troubleshooting Yield Problems in a Lead-Free World
Tuesday, August 19 | 10:00am – 11:30am | Speaker: Ray Prasad, Ray Prasad Consultancy Group
SMT has been in use in high volume since 1985 and BGA has been in use in high volume since 1995. But even after all these
years of high volume experience, less than 10% of companies have yield over 90%. That means 90% of companies are doing
too much rework. This free session focuses on three major areas of defects in SMT: design, assembly and the quality of incoming
materials, including surface finishes, reflow and some issues in lead-free wave soldering and their root causes.
Counterfeit Electronics
Tuesday, August 19 | 1:30pm – 3:00pm | Speaker: Don Trenholm, Custom Analytical Services
Counterfeit electronic components, which pose severe performance and reliability threats, are finding their way into commercial,
military and medical assemblies and are causing a huge economic impact in these Industries. This presentation provides
information relating to the electronic fraudulent/counterfeit components problem, and offers detection and prevention methods.
iNEMI Roadmap
Tuesday, August 19 | 3:30pm – 4:30pm | Speaker: Chuck Richardson, iNEMI
The 2009 iNEMI Roadmap covers at least 20 TWG (Technical Working Group) chapters grouped into five technology groups:
Semiconductor Technology, Business Processes/Technologies, Design Technologies, Manufacturing Technologies and Component/
Subsystem Technologies. Within the groups are the 20 chapter designations – including two new TWGs (Solid State Illumination
and Photovoltaics). The roadmap also includes five product sector (PEG) chapters with associated product emulators. The
presentation will go into what makes up the individual chapters and how the process works to culminate in a complete document.
50 – Global SMT & Packaging - August 2008 www.globalsmt.net
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