Update on lead-free solder joint reliability
Associates, L.C., a firm providing consulting Product Reliability. He was elected into the Laboratories Distinguished Member of
services on reliability, manufacturing and IPC Hall of Fame 2003, and was awarded the Technical Staff in 1986 and an IMAPS Fellow
processing aspects of electronic packaging IPC President’s Award in 1996 and the IEPS in 1996. More information is available at
and interconnection technology. He is the Electronic Packaging Achievement Award in www.engelmaier.com, and he can be reached
Fig. 13
chairman

of


the IPC Main Committee on 1987. He also was named a Bell Telephone at engelmaier@aol.com.

100
680 I/O PBGA on FR-4,











90
ATC: per IPC-9701
0
100°C, 10°C/min ramps,
]
CBGAs,
75







Solder Joints: SAC 405
































1206/2512 Chips
“HIGHER STRAIN”:












10

10 minute dwells
SnPb > SAC
50

30 minute dwells




















d

 60 minute dwells 

























PBGAs ATC: Various
25


















1
SnPb
a
i
l
e







‘Tessera’

F


CSPs
SAC



















%
10




“LOWER STRAIN”:
SAC > SnPb Compliant
Leaded Devices
5





verage Shear Strain [%
0.1
A





2
0.01
10
5
10
6
10
7
10
8
10
9
10
10
1
Cycles-to-Failure/Crack Area [cycles/sq.in.]
10
3
2,000 3,000 5,000 7,000 10
4
Cycles-to-Failure
13
10
2
10
3
10
4
10
5
10
6
Approximate Cycles-to-Failure
14
Figure 13. Weibull plots of SAC405 solder joints with cyclic dwells of 10, 30, Figure 14. Manson-Coffin plot of SnPb and SAC solder joint accelerated creep-fatigue
and 60 minutes [Source: John Mannock, et al., Alcatel-Lucent, USA]. test results. [Source: After Jean-Paul Clech, EPSI Inc., USA].
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www.globalsmt.net Global SMT & Packaging - August 2008 – 49
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