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Packaging
Packaging
V
olume
V
olume
8 8
Issue Issue
88
The
G
l
loba
l
l
Assemb
l
ly
Journa
l
l
f
for
SMT
and Volume 8 Number 8 August 2008
Advanced Packaging Professionals
ISSN 1474 - 0893
Don Naugler
Interview Inside
AdvAnces in solder bAll plAcement
n e w p r o d u c t s
for surfAce-mountAble pAckAges
i n d u s t r y n e w s
understAnding hidden reActions And
August August
the importAnce of profile in reflow
i n t e r n at i o n a l d i a r y
soldering, pArt 2
20082008
pArAllel print & inspection processes
to Achieve 100% post-print inspection
NB: Spine Text in Bleed.
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