SMTA International 2008 Technology Preview
Technology Preview
Last year’s show saw companies wait-listed for a spot on the exhibition floor. This year’s SMTAI features a
newly expanded exhibit floor, with a focus, once again, exclusively on the electronics assembly industry. This
year’s show will see the introduction of new technologies and updates to existing technologies. Here’s a small
preview of what’s in store for exhibition visitors.
Aqueous Technologies – Booth 207 Dynatech Technology – Booth 224 slots (up to 108) in a small footprint of
Aqueous Technologies Corp. introduces Dynatech Technology, the exclusive less than 1 square meter.
the Trident III, its automatic defluxing North American distributor of SMT www.essemtec.com
and cleanliness testing system capable of solutions from Samsung, brings the latest
removing all flux residues including rosin, member of the SM400 series platforms to
no-clean and water soluble. Both lead and the North American market. Samsung’s
lead-free flux residues may be removed SM411 dynamic chip shooter places at
using the system, and it is equipped with a rate of 42,000 cph based on the IPC
an automatic chemical injection system 9850 standard handling components from
that automatically adds a programmable 01005 through 14mm2 with placements
volume of defluxing chemical to the wash accurate to ±50µ at 3 sigma (Cpk ≥1.0).
water. The automatic defluxing system The dual gantry system includes a dual-
is reportedly the fastest batch-format lane PCB transport with three on-demand
defluxing system available. production configurations—visit the
www.aqueoustech.com Dynatech booth for complete information
on this. www.dynatechsmt.com
DEK – Booth 800
Long regarded the premiere print platform ECD – Booth 526
for maximum value and exceptional Recognized with industry awards for both
manufacturing flexibility, DEK’s Horizon product design and its M.A.P. software,
03i system is newly equipped with a ECD’s MEGAM.O.L.E.®20 thermal
redesigned gull wing cover to enable easy profiler is the industry’s only twenty-
accessibility and operator convenience. channel profiler, yet is the thinnest at 7.2
In addition, the Horizon 03i, run on mm. This proves especially beneficial
DEK’s award-winning Instinctiv™ V9 when dealing with physical constraints Global Automation – Booth 117
operating system, is now compatible of nitrogen curtains, and when profiling Adding to the successful line of soldering
with Productivity Tools that include smaller cell-phone-type boards. Data- and dispensing solutions from Global
the throughput enhancing Cyclone rich software enables focusing on complex Automation, BT303 is a benchtop robot
understencil cleaning technology, components such as BGAs and allows based on 3 or 4 fully programmable axes
HawkEye™ high-speed print verification 185 customizable data extractions. With and is adapted for semi-automatic point-
tool and HD Grid-Lok® reconfigurable three workflow wizards for ease of use, to-point soldering or liquid dispensing
high-density tooling solution. and clear readiness indicators to prevent operations controlled by a programmable
www.dek.com wasted runs, the MEGAM.O.L.E.®20 has logic controller. Its design guarantees a
the capacity for well over 25 runs before turnkey solution and allows the customer
downloading data. www.ecd.com immediately implement its capability
easily in an ‘out of the box’ package.
Essemtec – Booth 211 www.globalautomation.com
Essemtec will exhibit the PANTERA-XV
SMD placement system for prototyping Henkel – Booth 806
and production runs in mid-sized Henkel’s breakthrough epoxy flux
quantities. PANTERA-XV provides high material, Hysol® FF6000, combines flux
placement accuracy and speed, a broad functionality and underfill protection
application range and high reliability and into a single material. A reflow curable
very low maintenance costs, as well as material, Hysol FF6000 has been
very short changeover times and excellent formulated to provide fluxing action
cost-performance ratio. It handles the for lead-free solder joint formation
entire SMD range from 0201s to 50 x 50 and, when cured, delivers underfill-like
mm QFPs with a fine pitch of 0.4 mm. protection against mechanical stress.
Designed for the assembly of complex The versatility of the material allows for
printed boards and fast changeover, the various deposition methods including
machine offers a large number of feeder screen printing, dispensing, dipping and
52 – Global SMT & Packaging - August 2008 www.globalsmt.net
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