SMTA International 2008 Technology Preview
version—may flexibly be integrated into mm. Proven 6-nozzle and 12-nozzle heads VJ Electronix – Booth 825
any automated production line. During and the Twin Pick&Place head for super- VJ Electronix will showcase its Vertex
the process the assembly remains on its precise IC placement are also available for Series-CT x-ray system, a high-resolution
position whereas the working stations, the X-series. By combining a 20-nozzle- computed tomography system that is
which are mounted on a high-precision Collect&Place head with a Twin Head, designed and dedicated to providing
axis system, successively approach the new Siplace covers the complete the accuracy and reliability required
the solder joints. This allows flexible component spectrum from 0201 (01005) to analyze the inner structure of any
processing of assemblies up to 500 x 500 to 85 x 85 mm or 125 x 10 mm including specimen. Vertex Series-CT can be
mm with absolutely reproducible results. all odd-shaped components. tailored to any application through
www.sehona.com www.siplace.com its flexible configuration capabilities.
Therefore, a range of x-ray tubes (sealed
and open), detectors, motion hardware
and mechanical components are available.
The system software is provided through
cooperation with the Fraunhofer Institute
and offers a very intuitive operator
interface. The system can be set up for
a component scan in a very short time.
www.vjelectronix.com
ZESTRON – Booth 725
ZESTRON’s FAST Technology-based
cleaning agents are a proprietary mix of
newly developed surfactants that allow
for quicker removal of a wide variety
of the latest lead-free and eutectic flux
SIPAD Systems – Booth 312 residues. When compared to traditional
SIPAD Systems Inc. has brought stencil Thermo Fisher Scientific – Booth 309 surfactant-based cleaning agents, this new
manufacturing in-house with the Thermo Fisher Scientific Inc. will technology removes flux residues under 1
purchase of a Tannlin T-8 Fiber Laser and demonstrate its third-generation handheld MIL standoff components at a 1.7ft/min.
associated support equipment and will Thermo Scientific Niton XL3 700 Series belt speed and requires a reduced amount
begin stencil production in their expanded x-ray fluorescence (XRF) analyzers. These of active ingredients for the complete
Alpharetta, Georgia, facility. instruments provide the fastest solder removal of contaminants from substrate
The SIPAD process used a stencil to alloy grade identification and laboratory- surfaces. FASTTM Technology cleaning
apply paste and over the last two years quality composition analysis of plastics agents are guaranteed to meet the highest
SIPAD Systems has purchased on average and polymers ever performed with a cleaning requirements such as the IPC
20-30 stencils per month. “Bringing the handheld XRF analyzer. Typical time for 610, the J-STD 001 as well as the IPC-
process in house just made sense,” said routine solder screening measurements is TM 650. www.zestron.com
Matt Kehoe. “Faster response and cheaper less than 5 seconds – as much as 2 _ times
prices are what keep our customers faster than our previous generation of
coming back. Just the money we’ll save analyzers. The XL3t features a 50 kilovolt,
on the shipping will help make the laser 2-watt x-ray tube, the highest power x-ray
affordable.” tube ever offered in a handheld XRF
SIPAD Systems Inc. is the first and analyzer, as well as advanced electronics
only dedicated solder coating service that enable a host of new features
bureau in the world, supplying solder directly benefiting the customer. Thermo
coating services to OEMs, CEMs Fisher Scientific is the world’s leading
and printed circuit suppliers in the manufacturer of handheld XRF analyzers.
commercial, military, space and defense www.thermo.com/niton
industries. www.sipad.com
Siemens Electronics Assembly
Systems – Booth 201
Siemens Electronics Assembly Systems
will demonstrate its high-speed Siplace
X3 placement machine. The Siplace
X-Series platform sets new benchmarks in
all criteria that matter for high-efficiency
electronics production: speed, flexibility,
quality, and investment protection. With
its newly designed Siplace 20-nozzle
Collect&Place head, Siplace X3 can place
components ranging from 01005s to 6 x 6
54 – Global SMT & Packaging - August 2008 www.globalsmt.net
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