MicroNanoSystems News
Replisaurus to collaborate
IP for 3DIC
with IMEC on 3D
AS the semiconductor industry
explores the most effective way to
integration research
implement true 3D integration of
advanced semiconductors, Ziptronix is
developing strategies for licensing its
S.E.T. Smart Equipment Technology, a The parties will collaborate to develop patented interconnect technologies
wholly-owned subsidiary of Replisaurus highly accurate pick and place across the semiconductor supply
Technologies and a supplier of high processes and low temperature chain.
accuracy die to die (D2D), die to wafer bonding processes, which are required According to Ziptronix CEO Dan
(D2W) bonding and nano-imprint by advanced 3D integration schemes. Donabedian, the company is uniquely
lithography solutions, announced that “The integration of the FC300 will positioned to deliver the low
they will collaborate with IMEC, an be a welcome addition to our 3D temperature IC bonding process that
independent nano-electronics research programme, as is the participation of the semiconductor industry needs to
Issue I 2009
institute, on the development of die S.E.T. and Replisaurus,” said Luc van make true 3D IC integration a
square4
pick and place and bonding processes den Hove, Executive Vice President and practical reality. “We’re currently
.com
for 3D chip integration, using S.E.T.’s COO of IMEC. “The Replisaurus and engaged in substantive licensing
Flip Chip bonder equipment. S.E.T. technologies are very interesting discussions with customers in multiple
IMEC’s 3D integration programme for advanced packaging applications, market segments at all levels in the
explores 3D technology and design for and the integration of this tool in semiconductor supply chain, and we
applications in various domains, particular will help complete our anticipate that several license
focusing on 3D wafer-level packaging programme.” agreements will be reached in the
and 3D stacked ICs to find innovative “IMEC’s installation of the FC300 is coming months.”
oasiasemiconductor
solutions for the cost effective use of fully in line with Replisaurus’ product Donabedian explained that the
.eur
3D interconnects. and technology portfolio, which offers process IP delivers important
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The joint development programme game changing opportunities to the competitive advantages at each link in
will employ S.E.T.’s FC300, which is a global chip market,” said James Quinn, the current supply chain. “Our
13
high accuracy (≤0.5 µm), high force CEO of Replisaurus. “IMEC’s advanced patented bonding and interconnect
(4,000N) device bonder system for die 3D integration program is recognised technologies can be implemented at
to die and die to wafer bonding on worldwide, and the FC300 is extremely all levels of the semiconductor supply
wafers up to 300mm. The programme is complimentary to Replisaurus’ chain with little additional capital
scheduled to begin during the first ElectroChemical Pattern Replication expenditure for new process
quarter of 2009, at which time S.E.T. will (ECPR) technology, which is well suited equipment.”
enter the IMEC’s Industrial Affiliation for advanced 3D integration and related “The OEM/IDM customers and
Programme (IIAP) on 3D integration. applications.” fabless semiconductor manufacturers
can now develop device designs that
use true 3D integration to achieve
MEMSCAP announce new GM
more functionality through building
multilayer chips, instead of relying on
traditional 2D device scaling,” he
MEMSCAP has announced the positions from purely technical roles to continued. “In turn, semiconductor
appointment of Steve Wilcenski as team and high-technology programmes foundries will now be able to provide
General Manager of the Custom management through sales and their customers a high volume, high
Products Business Unit. Steve holds a marketing responsibilities. throughput W2W bonding process
BS in Materials Science and Engineering Deputy General Manager of the without compromising yields.”
from North Carolina State University, a Custom Products Business Unit since The company is operating from a
Master of Science in Chemistry from January 2007, his appointment as strong base of IP relating to 3D IC
Clemson University and an MBA from General Manager is in line with the integration.
North Carolina State University. His logical progression of his career at “Ziptronix has developed
extensive field expertise encompasses MEMSCAP. significant worldwide patents
many key technologies such as MEMS, The tasks entrusted to Steve fall covering the basic concepts of low
nanotechnologies, lasers and LEDs, as within the global scope of growth and temperature oxide bonding,”
well as crystal growth. manufacturing of the business unit with Donabedian continued. “We believe
He was an engineer at JDS a focus on keeping the business unit that virtually any use of low
Uniphase prior to joining the profitable, growing the customers and temperature oxide bonding processes
MEMSCAP Group at the end of 2001, partners portfolio, as well as developing is likely to be covered by one or more
Steve has been entrusted with many new programmes and R&D vision. of our patents.”
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