Test & Measurement
the prober is that, no matter which type of
measurement is being made, no changes to the
probe manipulator cabling are required. This
makes it much simpler to switch between I-V
measurements, C-V measurements, and pulsed
testing, simplifying the device characterization
process.
Issue VI 2009
In addition, the setup changes can be made
square4
while the probe needles are in contact with a
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wafer, reducing pad damage and maintaining
the same contact impedance for all three types
of measurements.
Many I-V and pulse measurements are made
on devices with more than two terminals. The
most common device type is a four-terminal
MOSFET. Figure 10 illustrates an I-V Figure 11: A pulsed I-V measurement setup
oasiasemiconductor
measurement setup for a four-terminal DUT.
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The connectors can be disconnected and
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shorting caps inserted into the source and bulk
cables to allow making a pulse measurement.
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Figure 11 illustrates a pulsed I-V measurement
setup.
An added benefit of having short cables
near the DUT is that it’s possible to short
together the terminals of a DUT that function at
frequencies up to or greater than 1MHz. Figure
12 shows a four-terminal C-V measurement in
which three of the four terminals are connected
together to allow making a two-terminal C-V
measurement.
The frequency at which the C-V
measurement can be made can be increased by
connecting the three terminals together at the Figure 12: A four-terminal C-V measurement in which three of the four
prober rather than at the LCR/C-V meter. terminals are connected together for a two-terminal C-V measurement
Cable requirements for I-V, C-V, and Pulsed I-V measurements
DC I-V measurements * Triaxial cables
* Kelvin connection
* Isolated, driven guards
LCR/C-V measurements * Coaxial cables
* Kelvin connection
* Shields connected at the probe tips
Pulsed I-V measurements * Coaxial cables
* Non-Kelvin connection (single cable)
* Shields connected at the probe tips
* Shield optionally connected to a probe tip
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