Electroless plating system for the UBM
of aluminum or copper pads (Ni, Pd, Au).
Designed for substrates up to 300mm and
50-1000μm thickness.
- Greater bath longevity due to specially
developed software and hardware
- Processes both sealed and
resist coated wafers :contact
- Utilizes Fraunhofer Technology and actively
AP&S International GmbH
supported by the Fraunhofer Society Obere Wiesen 9
- Highest throughput
78166 Donaueschingen
info@ap-s.de
Phone +49-771-8983-0
Fax +49-771-8983-100
www.ap-s.de





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