Transfer printing: an emerging technology for massively parallel assembly
conclusions
S.J. Kang, Y. Sun, R.G. Nuzzo and J.A. Berlin Heidelberg, 2007.
Transfer printing is a promising new
Rogers, “Heterogeneous Three Dimen- 17. B. Keser, C. Amrine, T. Duong, O. Fay,
technique for applications requiring high
sional Electronics Using Printed Semi- S. Hayes, G. Leal, W. Lytle, D. Mitchell,
accuracy assembly of large numbers of
conductor Nanomaterials,” Science, 314, R. Wenzel, “The Redistributed Chip
microscale devices. Unlike traditional
1754-1757 (2006). Package: A Breakthrough for Advanced
assembly approaches that use vacuum
8. D.Y. Khang, H. Jiang, Y. Huang and J.A. Packaging,” Proc. Elec. Comp. Tech.
chucking, transfer printing utilizes a
Rogers, “A Stretchable Form of Single Conf. (57th ECTC), Reno, NV (2007).
microstructured elastomeric stamp to both
Crystal Silicon for High Performance
pick-up and place microscale devices. Here,
Electronics on Rubber Substrates,” Sci-
we demonstrated transfer printing of 5 µm
ence, 311, 208-212 (2006).
thick silicon chips with high yield (> 99%)
9. Y. Sun, S. Kim, I. Adesida and J.A. Dr. Christopher A. Bower is Senior
and accuracy (< ± 4 µm @ 3σ).
Rogers, “Bendable GaAs Metal-Semicon- Research Scientist at Semprius Inc.,
ductor Field Effect Transistors Formed where he works on the heterogeneous
acknowledgements
With Printed GaAs Wire Arrays on integration of compound semiconductors
The work presented here was partially
Plastic Substrates,” Applied Physics Let- with silicon integrated cirucits. He previ-
supported through an NSF SBIR program
ters 87, 083501 (2005) ously held positions at Inplane Photonics
on flexible display backplanes (NSF IIP-
10. Y. Sun, E. Menard J.A. Rogers, H.-S. as a senior process development engineer
0712017).
Kim, S. Kim, G. Chen, I. Adesida, R. and as a scientist at RTI International,
Dettmer, R. Cortez, and A. Tewksbury where he served as the technical lead on
references
“Gigahertz Operation in Mechani- multiple DARPA-funded 3D integration
1. M. B. Cohn, K. F. Bohringer, J. M. No-
cally Flexible Transistors on Plastic programs. Dr. Bower has authored or
worolski, A. Singh, C. G. Keller, K. Y.
Substrates,” Applied Physics Letters 88, co-authored over 40 peer-reviewed publi-
Goldberg, R. T. Howe, “Microassembly
183509 (2006). cations and holds 2 U.S. patents.
technologies for MEMS,” in Proc. SPI
11. K.J. Lee, M.A. Meitl, J.-H. Ahn, J.A.
E Micromaching and Microfabrication,
Rogers, R.G. Nuzzo, V. Kumar and I. Dr. Philip Garrou is a consultant in the
Santa Clara, CA, Sept. 20 – 22, 1998,
Adesida, “Bendable GaN High Electron field of thin film microelectronic materi-
pp. 2 – 16.
Mobility Transistors on Plastic Sub- als and applications, prior to which he
2. W. Zesch, M. Brunner, and A. Weber,
strates,” Journal of Applied Physics 100, was director of technology and new busi-
“Vacuum tool for handling microobjects
124507 (2006). ness development for Dow Chemicals’
with a nanorobot,” in International
12. M.A. Meitl, X. Feng, J. Dong, E. Me- Advanced Electronic Materials business.
Conference on Robotics and Automa-
nard, P.M. Ferreira, Y. Huang and J.A. He has authored two microelectronics
tion, April 1997, pp. 1761.
Rogers, “Stress Focusing for Controlled texts and is co-author of over 75 peer
3. H.-J. J. Yeh and J. S. Smith, “Fluidic
Fracture in Microelectromechanical reviewed publications and book chapters.
assembly for the integration of GaAs
Systems,“ Applied Physics Letters 90,
light-emitting diodes on Si substrates,”
083110 (2007). Etienne Menard, Founding Scientist,
IEEE Photon. Technol. Lett., vol. 6,
13. E. Menard, J. Park, S. Jeon, D. Shir, Y. obtained a PhD degree in Chemistry at
1994, pp. 706 – 708.
Nam, M. Meitl and J.A. Rogers, “Micro the University “Pierre et Marie Curie”
4. U. Srinivasan, D. Liepmann, and R.T.
and Nanopatterning Techniques for (Paris, France) and the Department of
Howe, “Microstructure to substrate self-
Organic Electronic and Optoelectronic Material Science and Engineering at
assembly using capillary forces.” Journal
Systems,” Chemical Reviews 107, 1117- the University of Illinois at Urbana-
of Microelectromechanical Systems,
1160 (2007). Champaign (UIUC) under the direction
vol.10, 2001, pp. 17 - 24.
14. M.A. Meitl, Z.-T. Zhu, V. Kumar, K.J. of Denis Fichou at the “Laboratoire
5. E. Menard, K.J. Lee, D.-Y. Khang, R.
Lee, X. Feng, Y.Y. Huang, I. Adesida, des Semi-Conducteurs Organiques”
G. Nuzzo and J.A. Rogers, “A printable
R.G. Nuzzo and J.A. Rogers, “Transfer (CEA/SACLAY, France) and Prof. John
form of silicon for high performance
Printing by Kinetic Control of Adhe- A. Rogers at UIUC. He received an
thin film transistors on plastic sub-
sion to an Elastomeric Stamp,” Nature engineering diploma in Electronics from
strates,” Applied Physics Letters, 84(26),
Materials 5, 33-38 (2006). the National Polytechnic Institute of En-
5398-5400 (2004).
15. J. P. Lu, K. Van Schuylenbergh, J. Ho, gineering in Electrotechnology, Electron-
6. J.-H. Ahn, H.-S. Kim, K.J. Lee, Z. Zhu,
Y. Wang, J. B. Boyce, R. A. Street, “Flat ics, Computer Science and Hydraulics
E. Menard, R.G. Nuzzo and J.A. Rogers,
panel imagers with pixel level amplifiers (ENSEEIHT) at Toulouse (France) in
“High Speed, Mechanically Flexible Sin-
based on polycrystalline silicon thin-film 2002. His research has been featured
gle-Crystal Silicon Thin-Film Transistors
transistor technology,” Applied Physics on the covers of recent issues of Applied
on Plastic Substrates,” IEEE Electron
Letters, 80, 4656 (2002). Physics Letters, Physics Status Solidi A,
Device Letters, 27(6) 460-462 (2006).
16. Concentrator Photovoltaics edited by Advanced Materials and others.
7. J.-H. Ahn, H.-S. Kim, K.J. Lee, S. Jeon,
A. Luque, V. Andreev, Springer-Verlag,
www.globalsolartechnology.com Global Solar Technology – November/December 2008 – 23
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