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Mexitronica APEX
October 21-23 2009 March 31-April 02, 2009
Guadalajara, Mexico Las Vegas, NV, USA
IMAPS 2008 NEPCON China 2009
November 2-6 2009 April 21-24, 2009
Providence, RI Shanghai, People’s
Stand 115-17 Republic of China
National Electronics
Week
2009 Pan Pacific SMT/HYBRID/
June 16-18, 2009
Conference PACKAGING
Earls Court, London, UK
February 10-12, 2009 May 5-7, 2009
Big Island, HI, USA Nuremberg, Germany
cemconex A4 29/7/08 10:18 Page 1
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16 & 7 OctCEMCONEX, aober
Romania is one of Europe’s fastest growing markets...
two With membership to the EU and a geographical position
your local sales rep today.
monthly local-language & local-
that facilitates easy and low cost access to the rest of
T
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a, R
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destination of choice for numerous
and exhibition
multinationals.
content newsletters for China, Korea,
Tw
fo
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r CEM
y ev
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eaturing h
Timisoara, located i
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Romania, is now globally nised
tan- Website & email advertising
Japan, Hungary, India and UK/
as a hot-spot for the electronics
dard t
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a low cost, highly
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skilled
Sandy Daneau
workforce, many tier one and tier two manufacturers have
Ireland—you can sign up for any or
Timisoara, Romania located to the region.
exhibit
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October
ganized in conjunction CEMCONEX will feature a series of high standard technical papers Tel: +1 (603)-686-3920
addressing the manufacturing challenges of
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wit
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companies in this region.
eting Int
The technical con
ernational.
ference
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will be complemented by
Key topics will include:
a table-top exhibition area cuits
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that is limited to 30
• Fle
xible Cir
exhibitors.
www.globalsmt.net There will also be a series • T
raceability
of practical and relevant
• R
eliability
workshops held during the
e
print & Video advertising
day. At close there will be a • A
utomotiv
networking party for Applications
delegates and exhibitors.
Europe—Andy Kellard
European Electronics
Tel: +44 (0) 77652 77677
•
For more information visit
EXHIBITION • TECHNICAL CONFERENCE • WORKSHOPS • NETWORKING •
www.cemconex.com
The Global Assembly Journal for SMT and Volume 9 Number 9 September 2008
Assembly Reliability
Advanced Packaging Professionals
akellard@globalsmt.net
ISSN 1474 - 0893
www.globalsmt.net Europe: +44 (0) 7765 277 677 | USA: +1 603 580 5549 | ASIA: +852 6339 6969
akellard@globalsmt.net ldandreti@globalsmt.net atan@globalsmt.net
Summit
Composite
22–24 October
United States—Lino D’Andreti
Tallinn, Estonia
Tel: +1 (603) 580-5549
One day of training workshops
ldandreti@globalsmt.net
followed by a two-day technical con-
ference on all aspects of electronics
Asia/Pacific—Amanda Tan
reliability and a tabletop exhibition.
Tel: 852- 6339 6969
Organized in conjunction with
atan@globalsmt.net
Neil MacRaild
Interview Inside
Soldertec Global and sponsored by
OPTIMIZING BATCH CLEANING FOR REMOVING NEW PRODUCTS
LEAD-FREE FLUX RESIDUES ON PCAS
Balver Zinn.
Korea—S.I. Yun
INDUSTRY NEWS
COMPATIBILITY OF POLYMERS AND FLUXES: GET-
TING TO THE HEART OF THE MATTER
INTERNATIONAL DIARY
www.europeanelectronicsummit.com
Tel: +82-31-781-9171
A BREATH OF FRESH AIR
siyun@globalsmt.net
46 – Global SMT & Packaging – September 2008
www.globalsmt.net
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