Contents
Volume 8, No. 10
October 2008
European edition
Global SMT & Packaging
is distributed by controlled
circulation to qualified
Contents
personnel. For all others, sub-
scriptions are available at
2 China feels the strain
a cost of £165.00 for the
Trevor Galbraith
current volume (twelve issues).
12
TechNOlOgy FOcus
No part of this publication may
be reproduced, stored in a
12 01005 assembly process—from the board design to reflow
retrieval system, transmitted
Norbert Heilmann, Siemens AG
in any form or by any means
electronic, mechanical, 16 SPC and usage difficulties in SMT
photocopying, recording or Mathias Keil, CeTaQ
otherwise without prior writ-
22 Process capability index: A better way to assess
20
ten consent of the publisher.
No responsibility is accepted for
equipment capability
the accuracy of information
Rita Mohanty , Speedline Technologies Inc., and Daryl Santos,
contained in the text,
Binghamton University
illustrations or advertisements.
The opinions expressed in the
34 Understanding the hidden reactions and the importance of
articles are not necessarily those
profile—part 3
of the editors or publisher.
Dr. S. Manian Ramkumar, Mr. Anand Kannabiran and Ms. Aarthi 30
Baskaran, CEMA at RIT, and Mr. Bjorn Dahle, KIC
ISSN No. 1474-0893
special FeaTures
© Trafalgar Publications Ltd
32 Interview: John Hartner—Dover Electronic Technologies
Designed and Published by
40 NEPCON South China reflects global slowdown
Trafalgar Publications Ltd,
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United Kingdom
REGULAR COLUMNS
Printed by Ovid Bell Press Inc.
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4 Hot air solder levelling—is it a HASL?
OThER REGULAR FEATURES
Bob Willis
26 SE Asian upturn, softness in Europe—No
8 Industry News
major disasters on horizon
42 New Products
Walt Custer and Jon Custer-Topai
46 Global SMT & Packaging Around the
World
48 Association News
52 International Diary
The trend towards ever smaller
components and more function
density continues unabated in
the SMT field.
www.globalsmt.net Global SMT & Packaging – September 2008 – 1
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