SE Asian upturn, softness in Europe—No major disasters on horizon
• Ammersbek, Germany, a producer of Kemtek Kemi & Teknik in Åby, Sweden, a 55,000 SF facility in Penang, Malaysia.
innovative PWB final finishes. filed for bankruptcy. Petroferm had its ISO 9001:2000 certifica-
• achieved ISO 9001:2000 and ISO Kyocera Chemical developed a new halogen- tion extended in Gurnee, Illinois.
14001:2004 certifications in Monter- free coverlay film for flexible circuits. Photo Stencil promoted COO Todd
rey, Mexico. MacDermid formed a separate photovoltaic Woods to interim CEO after Keith Favre’s
• Enthone opened a Semiconductor Ap- (solar cell) business. resignation.
plications Center in Taiwan. Matsushita Denko raised prices on epoxy Shinkawa commercialized its UTC-3000
CVD Equipment hired Gary Hudler as laminates by 15%, prepreg by 25% and wire bonding machine with an automatic
manufacturing operations manager of its mass lam by 15% on September 1. alignment correction system.
CVD/First Nano Division. Matsushita Electric Works introduced Shirai Denshi developed a soft transparent
ESI shipped its 250th 5330 microvia drill- rigid board to flexible circuit BTB connec- base substrate for flexible circuits.
ing system. tors with slim width (2.5 mm) and 0.4 mm Sumitomo Bakelite raised prices of epoxy
Göpel is investing €5 million to expand pitch. based laminates by 10%, phenolic based
capacity in Jena, Germany. Micro Tech is building a second manu- laminates 15% and glass prepreg 10%.
IIT developed a prototype assembly tool facturing plant in Niigata Prefecture Valor introduced its electronic design and
that allows manufacturers to assemble to expand its screen printing machine manufacturing software initiative “The
double-sided surface mount PCB assem- production capacity. Valor Innovation Circle.”
blies at their desks. Mikcell Oy (Finnish photomask company) Vishay’s $1.6 billion offer for International
Indium promoted Andy Seager to sales appointed Hartmut Lösch as sales director. Rectifier was rejected.
channel partner manager, Eric Bastow and Northrop Grumman received a contract ZESTRON Europe plans to open a 30,500
Mario Scalzo to senior technical support from DARPA for thermal management. SF Ingolstadt, Germany, facility before
engineers and Tom Pearson to inside Orbotech merged its IC division into its year-end.
sales manager for Solder Products, Global PCB division.
Processes. Pac Tech Packaging Technologies opened Market comments
20080911
20080913
Large EMS Providers
Global Electronic Equipment Shipment Growth
Composite of 11 Public Companies
Quarterly Revenue Growth
Taiwan/China
3/12 rate of growth in local currency
Europe
% Growth (quarter vs same quarter in prior year)
1.6 Japan
60.0
1.5
USA
0
1.4
40.0
1.3
1.2
20.0
1.1
1
0.0
0.9
0.8
-20.0
0.7
-40.0
0.6
1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2
1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7
01 02 03 04 05 06 07 08
00 01 02 03 04 05 06 07 08
Benchmark+Pemstar, Celestica, Elcoteq, Flextronics+Solectron, Foxconn, Jabil, Plexus, Sanmina-SCI,
Sypris, Universal Scientific, Venture Mfg
CALENDAR YEAR
Chart 5. Chart 6.
20080903 20080907
Semiconductor Growth Rates
Electronic Equipment Production Growth
Total $ Shipments to an Area
Current $ Growth Rates Converted @ Constant Exchange Rates
3/12 Rate of Change
1.8
2006 2007 2008 2009 2010
1.6
World 9.9 8.9 6.4 6.5 9.0
1.4
SE USA 7.5 0.9 2.0 4.5 6.4
Asia
1.2
W Europe 1.1 5.9 6.1 1.6 4.5
1
Japan 3.6 -1.5 -3.8 1.0 3.8
0.8
N America
Europe
Four Tigers 8.2 9.0 4.6 4.5 6.4
0.6
Japan
Asia-Pac
0.4 China 22.3 21.3 14.1 13.4 15.3
1 5 9 1 5 9 1 59 1 5 9 1 5 9 1 5 91 5 9 1 5 9 1 5 9 15 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5 9 1 5
90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08
Total $ Shipments from All Countries to an Area
Henderson Ventures 9/2008
SIA website: www.sia-online.org/
www.hendersonventures.com
Chart 7. Chart 8.
28 – Global SMT & Packaging – September 2008 www.globalsmt.net
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