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Deposition
ALD is currently being used in nano- devices such as MOS, as well as assessed the
electronics to deposit high-k gate oxides, high-k existing gaps in the supply chain that if not
memory capacitor dielectrics, ferroelectrics and bridged, will prohibit companies from realising
metals and nitrides for electrodes and significant commercial gains.
interconnects. The need to control extremely By promoting the commercial benefits of
thin films is essential in high-k gate oxides. establishing an end-to-end supply chain, to
Methods of ALD are used to create high-k enable UK technology innovators to get
gate oxides such as HfO2 and nanolaminates like products to market faster and easier, gaps will
HfO2 – AI2O3. High aspect ratio diffusion be identified and recommendations for
barriers such as AI2O3, for Cu interconnects capitalizing on the opportunities these gaps
along with TiN and passivation layers for OLEDs present will be more reachable, particularly for
and polymers, also require ALD processes for start-up companies recently established.
their manufacture. Fuel cells and the highly Working together, the NanoKTN and JEMI
conformal coatings used in the production of are confident that the Nano Micro Systems focus
micro-fluidic and Nano Electronic Mechanical group will meet the objective of stimulating the
Systems (NEMS) also require the flexible and formation of a comprehensive end-to-end supply
precise thickness control processes offered by chain, for successful implementation of
ALD, to produce wear resistant, anti-stiction and nanotechnology.
chemical resistant coatings. The aim of this meeting was to evaluate the
issues of the supply chain in this emerging
Improving supply chain nanotechnology sector. This was achieved by
Despite the advanced developments in firstly introducing various aspects of ALD and its
nanotechnology that have occurred over the supply-chain through a series of presentations.
12
past few years, the industry is still relatively new After the presentations, two open sessions
and there are a number of gaps in the supply discussed topics surrounding the opportunities
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chain that prohibit products getting to market in and threats for the UK supply chain.
.eur an effective manner. By connecting members of The March event saw presentations from
oasiasemiconductor
the supply chain with one another, academia, key players in the industry, including Metryx,
research specialists, industrial practitioners and Oxford Instruments Plasma Technology, Beneq,
funding sources, can meet to discuss ideas and Loughborough Surface Analysis, Centre for
business opportunities, thus ensuring Process Innovation and SAFC Hitech, and
developments in this application of featured a table top exhibition which offered a
nanotechnology continue. unique opportunity for exhibitors to showcase
.com
The role of the supply chain in ALD was the their products and services. The presentations
theme of a Nano Micro Systems focus group looked at the developments of nano-electronics
activity hosted by the NanoKTN, in partnership and nano-materials in recent years and the
square4
Issue V 2009
with the Joint Equipment and Materials Initiative technologies and applications that are bringing
(JEMI), back in March. The one-day conference about positive changes in these areas.
considered new developments in the Highlights from the day included a
manufacture of advanced nano-electronic presentation by Julia Baker, Principal Research
Scientist at Kodak who looked at the
development of atmospheric pressure ALD
technology used in dielectrics and
semiconductor layers, and Mike Petty from
Loughborough Surface Analysis gave an
introduction to surface analytical and depth
profiling techniques.
Professor Paul Chalker from the University
of Liverpool looked at the use of ALD in the
manufacture of VLSI semiconductor logic and
memory devices, Paul Williams at SAFC Hitech
demonstrated how chemical precursors can be
designed to satisfy deposition requirements and
Mark Berry at Metryx looked at the mass
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