Association & institutes news
Association & institutes news
JEDEC and ECA (Electronic Components For a complete list of board of director
Association). The new document expands members, visit
www.smta.org/contact_
on existing standards to provide test methods us.cfm#board_officers.
and classification levels to identify the
ipc to hold ipc-9592 power
worst-case thermal process limitations for
conversion conference
all electronic components that may be
Power conversion standard IPC-9592,
processed as part of a circuit card assembly,
Requirements for Power Conversion
including passives, connectors, switches
Devices for the Computer and Telecommu-
and other devices.
high-performance electronics
nications Industries, is in its final stage of
IPC member companies may request
assembly cleaning symposium
production. In preparation for the release,
a free copy of J-STD-075 within 90 days of
IPC and SMTA announce the High-Perfor-
IPC has planned a unique conference on
its publication. Following the introduction
mance Electronics Cleaning Symposium
November 6, at the Wyndham Hotel DFW,
period, members may purchase a copy for
to be held at the Crowne Plaza Chicago
Irving, Texas, to discuss the details of the
$26. Nonmembers may purchase the new
O’Hare in Rosemont, IL, on October 28-
specification and outline the process and
standard for $52.
29, 2008.
input that went into developing this first-
If you have questions about J-STD-
Cleaning assemblies after the soldering
ever power conversion standard.
075, comments for consideration in the
process, in light of no-clean flux innova-
To register or for more informa-
next revision to this or J-STD-033, contact
tions, was only needed for the high-reli-
tion on the conference, visit www.ipc.
Crawford at
JackCrawford@ipc.org. www.
ability products. Increased complexity and
org/9592conference or contact Michelle
ipc.org
disruptive influences of miniaturization,
Michelotti, professional development
high I/O counts,,and lead-free soldering
coordinator, at
michmi@ipc.org or +1 847-
creates the need for engineers to reconsider
597-2822.
reliability standards and the benefits of
cleaning. The cleaning symposium will pro-
ipc executive Market & Technology
vide important information about cleaning
Forum, Meeting focus on the future
sMTa board of directors in today’s high-performance electronics
What forces will be shaping the electronics
election results announced industry.
industry of the future? Answering this ques-
The SMTA proudly announces its election Conference brochure:
www.ipc.org/
tion will be the focus of the IPC Executive
results for the board of directors for the CleaningConferenceBrochure. Sponsorshop
Market & Technology Forum Conference
term that began at SMTA International application:
www.ipc.org/CleaningConfSpon-
and the IPC Management Meetings, sched-
(August 17 through 21, 2008). sorshipApp. Tabletop application: www.ipc.
uled October 28-30, 2008, in Kissimmee,
Dan Baldwin of Engent Inc. was org/CleaningConfTabletopApp.
FL.
elected SMTA president. Roy Starks, Libra
“Planning the Future of the Electron-
Industries, Inc. was elected vice president
ics Industry” will be the theme of the IPC
of membership. Kola Akinade, Scientific-
Management Meetings on October 28,
Atlanta and Hal Hendrickson, Dage
with meetings for PCB, EMS, PCB supplier
Precision Industries Inc. were elected to the
and assembly equipment industry execu-
planning committee.
call for papers—abstract deadline
tives.
Those remaining on the SMTA board
November 3, 2008
“High Impact Trends Shaping the
of directors include VP technical programs,
The Materials Research Society announces
Electronics Industry of the Future” will be
Bill Barthel, Plexus Corp.; VP communica-
its call for papers for the 2009 MRS Spring
the theme of the two-day Executive Forum
tions, Tom Forsythe, Kyzen Corporation;
Meeting. Abstract submission opens Octo-
Conference on October 29-30.
treasurer, Marie Cole, IBM; and secretary,
ber 3, 2008. Web submission only; fax or
More information on the IPC Executive
Irene Sterian, Celestica, Inc. Planning
e-mail submissions will not be accepted.
Market & Technology Forum Conference:
committee members include chairperson
Leading-edge researchers working in
www.ipc.org/NAEMTF2008. More informa-
Dr. Denis Barbini, Vitronics-Soltec, Inc;
seemingly unrelated fields such as cell
tion on the IPC Management Meetings:
Joe Belmonte, Bose Corp.; Dr. Ning-Cheng
engineering, microelectronics, magnetism,
www.ipc.org/ManagementMeetingBrochure08.
Lee, Indium Corporation of America; and
surface engineering, and new materials
To register for one or both meetings, go to
Dr. Laura Turbini, Research in Motion.
synthesis will gather in San Francisco to
www.ipc.org/ExecMeetingsUS.
The SMTA bids a fond farewell to
exchange information across disciplines.
departing directors David Raby, STI Elec-
The 2009 MRS Spring Meeting will be
ipc J-sTD-075 classifies worst-
tronics, Inc.; Jim Kuehn, Tyco Electronics
held April 13-17, 2009, in San Francisco,
case thermal process limitations
Automation Group; and Steve Greathouse,
CA.. Additional information is also avail-
IPC—Association Connecting Electronics
Plexus Corp. They are congratulated for
able from MRS Member Services by phone
Industries® released J-STD-075, Classifica-
a job well done and given thanks for the
at 724-779-3003, by fax at 724-779-8313 or
tion of Non-IC Electronic Components for
years of dedication to the SMTA.
by e-mail at
info@mrs.org.
www.mrs.org/
Assembly Processes, developed jointly by IPC, spring2009
48 – Global SMT & Packaging – September 2008
www.globalsmt.net
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56