Contents
Volume 8, No. 10
October 2008
American edition
Global SMT & Packaging
is published monthly
Contents
by Trafalgar Publications
Limited. The journal is FREE
to qualified professionals and
2 China feels the strain
is available by subscription at a
Trevor Galbraith
cost of $380.00 for the current
12
volume (twelve issues).
TechNOlOgy FOcus
Periodicals postage paid at
Rahway NJ. Postmaster send ad-
12 01005 assembly process—from the board design to reflow
dress corrections to:
Norbert Heilmann, Siemens AG
Global SMT & Packaging, c/o
Mercury International Limited,
16 SPC and usage difficulties in SMT
365 Blair Road, Avenel, NJ
07001.
Mathias Keil, CeTaQ
No part of this publication
22 Process capability index: A better way to assess
20
may be reproduced, stored in
equipment capability
a retrieval system, transmitted
Rita Mohanty , Speedline Technologies Inc., and Daryl Santos,
in any form or by any means;
electronic, mechanical, photo-
Binghamton University
copying, recording or otherwise
without the prior written consent
34 Understanding the hidden reactions and the importance of
of the publisher. No responsibility
profile—part 3
is accepted for the accuracy of in- Dr. S. Manian Ramkumar, Mr. Anand Kannabiran and Ms. Aarthi 30
formation contained in the text, Baskaran, CEMA at RIT, and Mr. Bjorn Dahle, KIC
illustrations or advertisements.
The opinions expressed in the
special FeaTures
articles are not necessarily those
of the editors or the publisher.
32 Interview: John Hartner—Dover Electronic Technologies
ISSN No. 1474-0893 40 NEPCON South China reflects global slowdown
© Trafalgar Publications Ltd
Designed and Published by
Trafalgar Publications Ltd,
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REGULAR COLUMNS
Printed by Ovid Bell Press Inc.
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4 Sustainable manufacturing for electronics—
OThER REGULAR FEATURES
nice idea or moral imperative?
Joe Fjelstad
6 Industry News
26 SE Asian upturn, softness in Europe—No
42 New Products
major disasters on horizon
46 Global SMT & Packaging Around the
Walt Custer and Jon Custer-Topai
World
48 Association News
52 International Diary
The trend towards ever smaller
components and more function
density continues unabated in
the SMT field.
www.globalsmt.net Global SMT & Packaging – September 2008 – 1
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