1/3VerticalBleedBGA 8/28/08 1:41 PM Page 1
Glenbrook
X-ray Systems
for
BGA
Figure 11. Before reflow self-alignment Figure 12. After reflow self-alignment.
Inspection
Figure 12. Fiber across pads
rower process window, 01005 components has been the solder paste application for
are limited to applications where the range all who tried to develop and establish the
Affordable
of different components is not spread 01005 process in production. But this is
very wide. Therefore, 01005 components not surprising, since this process step has
Portable
are used where miniaturization is the key always contributed directly or indirectly to
driver, like in submodules, sensors and the most defects detected after reflow on
medical devices like hearing aids. In those surface mount boards. As a consequence of
Rentable
applications it is no problem that the elec- that, it makes sense to use an AOI to find
trical performance of those components and optimize the process parameters when
is also limited due to the small volume setting up the 01005 process. It may also
(e.g. limited capacitance). But their use is be a good idea to even inspect the printed
also beneficial if it is necessary to get the boards in a running production.
components close to active ones or when Nevertheless, 01005 is available today,
they need to be embedded in the PCB. Me- and it will be used in electronics produc-
chanically the small size has the advantage tion. It will not however replace the most
that the mismatch of the thermal expan- common passive components, like 0402
sion coefficient does no harm any more and 0603. It will be used for certain
when thermal stress is applied. applications and by a limited number of
To learn more go to
The solder joints are reliable, but electronic manufacturers.
www.GlenbrookTech.com
when the pad design for 01005 is done,
the designer has to keep in mind that now Norbert Heilmann is a product manager in
the adhesion of the copper pad to the FR4 the SIPLACE R&D department, Siemens AG,
material may become the weakest point, Munich, Germany.
especially when the packaging density is
high, due to miniaturization, and the pad
dimensions are getting smaller and smaller.
So far the most difficult process step
11 Emery Avenue
Randolph, NJ 07869, USA
800-600-8866
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