Title
Figures 2a through 2d. These graphs show wetting balance measurements for gold, tin, silver and copper OSP prior to reflow soldering.
Figures 3a through 3d. These graphs show the change in performance after one reflow cycle and a hold of 10 days in an ambient condition waiting for second stage assembly.
ing yields in production. on workshops. For further information on how
Further information on the solderability Bob may be able to support your staff with on
test equipment and testing services can be line consultancy, in house training go to www.
obtained at www.gen3systems.com/index.php. ASKbobwillis.com.
Bob Willis is a process engineer providing
engineering support in conventional and surface
mount assembly processes. He runs special
production features at exhibitions and also offers
his seminars and workshops worldwide. These
complement his own practical in hose hands
6 – Global SMT & Packaging – September 2008 www.globalsmt.net
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