New Products
thermal performance of the T-flex™ line print passes and results showed absolutely Ridge Numerics has focused on further
by increasing the thermal conductivity no damage to any of the devices. www. shortening the learning curve for first-time
to 5.0 W/mK. The soft material is
ovation-products.com users of CFdesign and adding industrial-
highly compliant, allowing for thinner strength problem solving capabilities to the
interfaces and overall improved thermal
JTAG/Boundary Scan platform
engineering desktop.
performance as measured by total thermal
SCANFLEX® incorporates new PXI
www.cfdesign.com
resistance. High compliancy accommodates
controllers for critical applications
applications where the tolerance stack-up
Goepel electronic introduced a new
Mouser Electronics now stocking
is high and the maximum mechanical
series of PXI-bus-based controllers for
TriQuint-WJ’s New WJA family
stress on the components must be low. The
its boundary scan hardware platform
Mouser Electronics, Inc., is now stocking
T-flex™ 700 is naturally adhesive for ease of
SCANFLEX®.
WJ Communication’s WJA1001 and
handling and assembly.
The new SFX/PXI1149/C4-FXT
WJA1021—the latest additions to their +5V
www.lairdtech.com
controllers incorporate the normally
Active Bias General Purpose Gain Block
external SCANFLEX® TAP transceivers
amplifier series. WJ Communications,
into the 1 slot/3U unit, whereas the TAP
Inc, recently acquired by TriQuint
interface cards (TIC) are linked externally.
Semiconductor, supplies radio frequency
The TICs are active so the complete signal
(RF) products and solutions for the
conditioning is performed directly within
wireless infrastructure and radio frequency
the test fixture or environmental test
identification (RFID) reader markets. www.
chamber for HASS/HALT applications.
mouser.com
Four different auto-identified TIC types
are available to accommodate various
Microchip Technology introduces
applications. The differential signal
low-power, auto-zero operational
interface ensures a secure transmission of amplifiers (op amps)
the TAP signals, even through multiple Microchip Technology Inc.’s
SUSS MicroTec unveils 300mm
interconnections and with over 4 meters of MCP6V01/2/3 (MCP6V0X) auto-zero, low
mask aligner for 3D packaging
cable length, a TCK clock frequency of up power, operational amplifiers (op amps)
The second generation of SUSS MicroTec’s
to 80 MHz can be maintained. feature a unique self-correcting architecture
MA300 production mask aligner features
www.goepel.com that enables ultra high precision, with an
a dedicated alignment kit for creating 3D
input offset voltage of just 2 µV maximum.
interconnects for applications like chip
Gore introduces online builder
They also feature high common-mode
stacking and 3D image sensor packaging.
for specifying ultra high density
rejection, rail-to-rail input/output and low
The new 3D-Alignment platform enables
interconnects
quiescent current, making them ideal for
bottom side and infrared alignment for
W. L. Gore & Associates (Gore) introduced
portable, battery-powered instrumentation
300 mm-based three-dimensional (3D)
an online builder for configuring GORE™
devices, such as those used in the industrial
packaging lithography applications, thereby
ultra high density (UHD) interconnects to
and medical markets.
www.microchip.com
enabling cost effective mask aligner systems
use in bench-top test systems, instrument
to meet the most aggressive technology
probe cable, parallel data link, production
roadmaps for thick resist applications
floor equipment, and automated test
and keep costs low relative to 1X Stepper
equipment. The new Ultra High Density
lithography solutions.
www.suss.com
Interconnect Builder is available at
www.gore.com/uhdbuilder
Fraunhofer report affirms superior
performance of Ovation’s hD Grid-
Lok™ board support technology
Agilent introduces low-cost DC
The results of a study conducted by the
power supplies with features typical
well-respected Fraunhofer Institute and
of costly models
commissioned by German electronics
Agilent Technologies Inc. introduced
distributor Ben Technologies have
the U8000 series single-output, non-
confirmed that Ovation Products’ HD Grid-
programmable DC power supplies, a low-
Lok reconfigurable tooling technology is an
cost expansion of the best-selling Agilent
extremely robust and cost-effective support
E3600 series. Beyond cost savings, these
solution for modern electronics production.
DC power supplies offer excellent value
Scientists at Fraunhofer used a 240 x
with features that are typical only in costly
135 x 1.6 mm PCB mounted with a variety
programmable models. With power ranging
of fine-pitch SMT components including
from 90 W to 150 W, they are suitable
0805, 0402 and 0201 passive devices,
Blue Ridge Numerics announces
for a variety of electronics-manufacturing
QFPs, flip chips and BGAs. The goal was
CFdesign v10 upfront CFD software
applications and provide reliable, affordable
to determine the maximum occurring print
power for educational uses.
www.agilent.com
Blue Ridge Numerics has announced
loads on the device surfaces located on the
the availability of version 10 of CFdesign
underside of the PCB. Pressure sensors were
upfront CFD software, the company’s
SphereTek process guarantees
used to monitor components on the bottom
flagship application dedicated to
solder sphere tolerances down
side of the board, with measurements taken
empowering engineers with CAD-driven
to ±2.5 µ
at eight different points to examine pressure
tools that optimise fluid flow and thermal
SphereTek LLC introduced a unique
load on the devices in the Z direction.
performance during the digital design
process that guarantees solder sphere
Squeegee pressure was systematically
phase.
tolerances down to ±2.5 µ, delivering
increased from 40 N to 160 N over several
In this major software release, Blue
guaranteed uniformity and sphericity.
54 – Global SMT & Packaging – September 2008
www.globalsmt.net
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