New Products
eliminating the effects of humidity or separated, the recovered silicon can be re- tion tool has annual capacity of 1 gigawatt
contaminants that could cause thermal used or sold as a commodity. Second, the (GW). The tool uses Nanosolar’s propri-
cycling or joint failure. The enhanced system allows for up to 95 percent recovery etary nanoparticle ink, which allows the
coverage properties of Heraeus SOL230 of the deionized water, the most commonly company to deliver solar cells with close to
paste enables solar cell manufacturers to used fluid in semiconductor and solar cell 14% efficiency that are simply printed. The
use less paste and save on material costs. manufacturing processes. The recapture system represents an esimtated cost of US
www.heraeus.de and reuse of high-cost DI water conserves a $1.65 million.
valuable resource while minimizing manu- This process eliminates the need for
hesse & Knipps introducing facturing outputs into municipal sewer high-vacuum chambers and the kinds of
wire bonder for solar market systems. www.pall.com high-vacuum based deposition techniques
Hesse & Knipps, manufacturer of high- from other industries according to Nanoso-
speed, fine pitch wedge bonders for the Kla-Tencor introduces p-6 surface lar. www.nanosolar.com
back-end semiconductor industry, will soon profiler system for scientific and
introduce a new wire bonder dedicated to solar metrology
the needs of the solar market in producing KLA-Tencor’s latest stylus surface profiling
CPV (concentrated photovoltaic) cells. system, the P-6™, offers a unique set of
The new BondJet 820 CPV will offer all advanced features for scientific research
of the advanced features of the company’s and photovoltaic solar cell manufacturing.
Bondjet BJ 820 wedge bonder, plus an The P-6 system benefits from measure-
extended table travel of 900mm x 350mm ment technologies developed on advanced
and expanded X axis travel via the use of semiconductor profiler systems, but in a
intelligent automation. smaller, more economical bench-top design
The BONDJET BJ 820 platform is an for samples up to 150 mm.
industry benchmark for wire bonding, of- The P-6 profiler has been qualified at
fering the fastest wiring speed, largest work BP Solar, a major photovoltaic manufac-
area and greatest axis accuracy available. turer. “Our evaluation of KLA-Tencor’s P-6
www.hesse-knipps.us system demonstrated high sensitivity to a
Dupont expands solamet
range of process conditions for multiple
thick film paste production
integrated modular exhaust surface metrology applications, including
DuPont is expanding production of its
header for semiconductor ARC films, emitter contacts, and front
Solamet thick film metallization pastes at
& pV manufacturing surface texture,” said Eric Daniels, vice
its Electronic Materials DuPont Dongguan
NEHP has announced the development president of technology at BP Solar. “The
Ltd. (EMDD) facility in China. The com-
of an integrated, modular exhaust gas P-6 will be a valuable asset for supporting
pany plans to more than double manufac-
handling system for semiconductor and PV our technology development and manufac-
turing capacity of Solamet pastes as part of
manufacturing which addresses the need turing improvement efforts.”
its overall strategy to more than triple its
to bring exhaust systems online faster for www.kla-tencor.com
sales to the photovoltaic industry.
tool hook-up while improving tool exhaust
DuPont expects its sales in the photo-
control setup time as well as reducing non- silicon genesis enters solar pV
voltaics market within the next five years
scheduled maintenance troubleshooting market with revolutionary wafering
to be more than US $1 billion, up from
time. The NEHP Exhaust Header Module technology
approximately US $300 million today.
(patent pending) manages a variety of Silicon Genesis has successfully produced
www.dupont.com
exhaust outputs on a standardized module solar substrates for the PV industry using
platform, reducing on site hook-up labor a revolutionary ‘kerf-free’ wafering process
hours and thereby speeding time to market technology developed by SiGen called
for new tools. www.nehp.com PolyMax™.
By eliminating sawing losses, the
pall corporation resource-recovery PolyMax™ equipment set can substantially
system for solar energy industry reduce the amount of polysilicon used
Pall Corporation introduced eight new within the ingot to wafer manufacturing
technologies that will advance the state of steps and also eliminate some of the costly
the art in the solar energy and semicon- consumables in today’s wafer manufactur-
ductor industries, the lead innovation of ing. First targeted to process monocrystal-
which is its new water and raw material line silicon to produce high-efficiency sili-
recapture system for solar silicon manu- con solar cells, the equipment is expected
facturing engineered to address two key to help the PV industry reach grid parity
challenges facing manufacturers of solar while simultaneously relaxing the shortage
silicon, an essential element in the produc- of polysilicon feedstock. www.sigen.com
tion of photovoltaic panels. First, the
system separates silicon particles produced nanosolar launches 1-gW
as a by-product of the manufacturing thin-film cigs production tool
process from the ultra-pure (deionized, or Nanosolar Inc. has launched a new deposi-
DI) water used in shaping the silicon logs tion throughput for the production of
from which silicon wafers are cut. Once CIGS thin-film solar cells. The produc-
www.globalsolartechnology.com Global Solar Technology – September/October 2008 – 27
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