Title
New products
indium corporation’s metallization
in surface-mount assembly and chip-scale
paste increases solar cell life
semiconductor packaging. Six-sigma
Solar manufacturers using emerging thin
repeatability at ±12.5 micron resolution
film solar cell technology are challenged
demonstrates capability in advance of
with high contact resistance, inadequate
current requirements for solar cell front-
adhesion, and ultraviolet degradation over
side and back-side metallization. DEK can
time, resulting in decreased energy output
also deliver the PVP1200 within shorter
and usable life of the solar cell. OnSpec®
lead-times than the current industry
LTTF-6363 low-temperature metallization
norm, taking advantage of shared-platform
paste was specifically developed for low
technology and high modularity to quickly
contact resistance and exhibits exception-
configure new machines to meet custom
ally low bulk resistance, thereby providing
specifications.
www.dek.com
increased power output. more effectively than traditional doping
LTTF-6363 also offers good screen methods, providing uniform thin films to
new back-side silver paste from
printing characteristics, enabling screen create superior anti-reflective coatings for
heraeus offers savings for silicon
printing of the collection grid with a line increased solar cell efficiency, with the flex-
pV cell fabricators
resolution of less than 80 micrometers. In ibility to vary the spray width to suit any
With superior coverage and adhesion prop-
addition, LTTF-6363 doesn’t spread after size of solar cell.
www.sono-tek.com
erties that outperform existing products
printing thereby reducing the shadowing
currently available, a new back-side silver
effect. high-speed solar-cell
bus bar paste from the Thick Film Materi-
LTTF-6363 increases the life of a solar
metallization platform from DeK
als Business Unit of Heraeus offers a high-
cell since contact resistance between it and
Heralding a new era of responsive and
quality, cost-effective solution for solar cell
the TCO layer doesn’t increase over time.
flexible metallization solutions available at
manufacturers. The new Heraeus SOL230
It can be cured at 165 ºC and has excellent
fast turnaround, DEK has introduced the
paste is lead and cadmium-free and ideal
performance and reliability over the life of
PVP1200 screen printer capable of 1,200
for mono- and multi-crystalline silicon
a solar cell.
www.indium.com
wafers-per-hour throughput and offering
solar cells. SOL230 paste can be processed
advanced automated features for high
on textured and untextured wafers and
sono-Tek WideTrack system for speed and repeatability.
allows the use of lead bearing and lead-free
liquid dopant solgel solutions The PVP1200 is built using expertise
solder ribbons.
Sono-Tek Corporation showcased the gained from DEK’s established high-
The increased adhesion of the paste
Sono-Tek WideTrack system at the 23rd accuracy screen printing platforms, proven
enables a better solder joint, virtually
European Photovoltaic Solar Energy Con-
ference and Exhibition in Valencia, Spain,
at the beginning of September. The Wide-
Track system is a highly effective method
for applying uniform coatings of liquid
dopant solgel solutions, phosphoric acid
solutions, titanium and zinc oxides, as well
as anti-reflection materials to maximize so-
lar cell efficiencies. The WideTrack system
ultrasonically atomizes small droplets to
enable solutions to be diffused into the cell
26 – Global Solar Technology – September/October 2008
www.globalsolartechnology.com
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